Alleged photos of iPhone 5 back released
Today, 9to5mac released a supposed picture of the back plate of Apple's next iPhone. Later, they released higher resolution photos and enumerated some of the new aspects featured in the leaked parts.
Today, 9to5mac released a supposed picture of the back plate of Apple's next iPhone. Later, they released higher resolution photos and enumerated some of the new aspects featured in the leaked plates.
As frequently happens before the release of a new iPhone, the last few months have seen a buzz of leaks and rumors regarding the upcoming iPhone, which will likely be revealed in the fall of this year, alongside iOS 6. This year included the prominent rumor of a larger iPhone screen.
The photos posted today on 9to5mac feature both black and white versions of the next generation iPhone back. The black and white parts of the back are just trim, and most of it is manufactured out of metal. One interesting characteristic of this new back is the metal antenna band, which actually appears to be molded into the metal backplates.
Apple has shown interest in unibody designs before, introducing unibody notebooks in 2008. Apple patent filings for unibody earbuds, and for a process to manufacture seamless device housings were also released this year.
The authenticity of 9to5mac’s leak has been called into question by critics, as it seems to indicate that the headphone jack of the upcoming iPhone will actually be located in the bottom corner of the device, rather than the top. Such a change has never occurred in any of the iPhones, although this feature has existed in Apple's iPod touch.
9to5mac also included a picture of what they believe to be the next iPhone’s frame and screen. The screen included a centered FaceTime camera, and a relocated earpiece. The tech-blog believes from the photo of the alleged front screen that "Apple is definitely testing these units with the Micro-SIM technology from the iPhone 4/4S".
When released, the iPhone will come with iOS 6, and other new features such as a 3D Map application, LTE and an improved processor.