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AMD 90nm Opteron Package Changes

AMD is going to start shipping out 90nm SOI Opterons by end of this year codenamed Athens/Troy/Venus and there are some changes in the 940-pin package design on 90nm compared to the current package design on 130nm Opteron. The changes include using organic instead of ceramic improved electrical characteristics with copper conductors and planes vs. tungsten, organic substrate color will be green or brown, package height reduced by 0.32 mm that will have minor impact on heat sink mounting implementation. The thermal and electrical specs of the 90nm package are as follows; 80A Max Idd, 68C Max Tcase and 95W Max power compared to 60A, 70C and 89W of the current 130nm package.

AMD is going to start shipping out 90nm SOI Opterons by end of this year codenamed Athens/Troy/Venus and there are some changes in the 940-pin package design on 90nm compared to the current package design on 130nm Opteron. The changes include using organic instead of ceramic improved electrical characteristics with copper conductors and planes vs. tungsten, organic substrate color will be green or brown, package height reduced by 0.32 mm that will have minor impact on heat sink mounting implementation. The thermal and electrical specs of the 90nm package are as follows; 80A Max Idd, 68C Max Tcase and 95W Max power compared to 60A, 70C and 89W of the current 130nm package.

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