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AMD Bulldozer Die, Llano Wafer Pictured

SemiAccurate have scored pictures of AMD’s next-generation processors at Globalfoundries’ GTC summit. The first is a die shot of Orochi, the first CPU of the Bulldozer family. The die shot is an 8-core, 4 “Bulldozer module” CPU, expected in late 2011 for Servers.

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SemiAccurate have scored pictures of AMD’s next-generation processors at
Globalfoundries’ GTC summit. The first is a die shot of Orochi, the
first CPU of the Bulldozer family. The die shot is an 8-core, 4
“Bulldozer module” CPU, expected in late 2011 for Servers.

The next picture is a blurry picture of a Llano wafer, held by AMD’s Chekib Arkout and Glofo’s Doug Grose. Unfortunately, no details on the wafer are visible thanks to the low resolution.

Neither shots give any important details away. Interestingly, not all 4 modules on the Orochi die seem to be identical, with the bottom dies having seemingly more cache and less functional units. Or, maybe it is an optical illusion?

Reference: SemiAccurate, SemiAccurate

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