AMD CPU Goes Green

AMD has entered into an agreement to license Amkor Technology Inc.’s lead free (Pb-free) electroplated wafer bumping technology. The growing adoption of flip chip packaging, coupled with the “Green” electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology. The semiconductor industry is steadily migrating from high-lead alloy formulations to a Tin-Silver (SnAg) alloy as the “solder of choice” for electroplating bumps onto semiconductor wafers.


AMD has entered into an agreement to license Amkor Technology Inc.’s lead free (Pb-free) electroplated wafer bumping technology. The growing adoption of flip chip packaging, coupled with the “Green” electronics movement, means that semiconductor manufacturers will increasingly turn to Pb-free wafer bumping technology. The semiconductor industry is steadily migrating from high-lead alloy formulations to a Tin-Silver (SnAg) alloy as the “solder of choice” for electroplating bumps onto semiconductor wafers.

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