AMD Started on 300-mm Wafer & Preps for 65nm

AMD has started running wafers through Fab36 in March 2005 and that first “wafer outs” would occur in the second-half of 2005. Only 300-mm wafers would be run at Fab36 in Dresden although the neighboring wafer fab — Fab30 — runs a 90-nm SOI manufacturing process on 200-mm diameter wafers. The whole idea is to begin to process 65-nm in the middle of 2005 and bring it into production in 2006. By mid-2005 100 percent of AMD64 manufacturing will be on 90nm SOI wafers and by then the ramp-up would have taken just six to nine months from first commercial silicon in the fourth quarter of 2004.


AMD has started running wafers through Fab36 in March 2005 and that first “wafer outs” would occur in the second-half of 2005. Only 300-mm wafers would be run at Fab36 in Dresden although the neighboring wafer fab — Fab30 — runs a 90-nm SOI manufacturing process on 200-mm diameter wafers. The whole idea is to begin to process 65-nm in the middle of 2005 and bring it into production in 2006. By mid-2005 100 percent of AMD64 manufacturing will be on 90nm SOI wafers and by then the ramp-up would have taken just six to nine months from first commercial silicon in the fourth quarter of 2004. AMD engineers are helping Singapore foundry Chartered Semiconductor Manufacturing install the APM system in Chartered’s 300-mm wafer fab along with an AMD 90-nm SOI process. Running 90-nm circuits on 300-mm wafers with Chartered would also help build up useful experience.

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