AMD today announced that its Torrenza Initiative is serving
as a collaborative force toward achieving future processor socket compatibility
in the server industry. OEMs will be able to standardize on a Torrenza Innovation
Socket for many of their current and future server platforms. This approach
to server design will enable OEMs to consolidate server offerings for multiple
processors to potentially a single platform, reducing datacenter disruption
and deployment costs for customers. The Torrenza initiative is establishing
AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon, including Cray, Fujitsu Siemens Computers,
HP, IBM and Sun Microsystems have endorsed Torrenza as an open innovation initiative,
and plan to evaluate the Torrenza Innovation Socket. The Torrenza Innovation
Socket enables OEMs who develop their own silicon to take full advantage of
an x86 environment and the accompanying economics associated with packaging,
chipsets and motherboard designs. OEMs will be able to contribute to and obtain
the Torrenza Innovation Socket Specification and associated design documentation.

AMD today announced that its Torrenza Initiative is serving
as a collaborative force toward achieving future processor socket compatibility
in the server industry. OEMs will be able to standardize on a Torrenza Innovation
Socket for many of their current and future server platforms. This approach
to server design will enable OEMs to consolidate server offerings for multiple
processors to potentially a single platform, reducing datacenter disruption
and deployment costs for customers. The Torrenza initiative is establishing
AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon, including Cray, Fujitsu Siemens Computers,
HP, IBM and Sun Microsystems have endorsed Torrenza as an open innovation initiative,
and plan to evaluate the Torrenza Innovation Socket. The Torrenza Innovation
Socket enables OEMs who develop their own silicon to take full advantage of
an x86 environment and the accompanying economics associated with packaging,
chipsets and motherboard designs. OEMs will be able to contribute to and obtain
the Torrenza Innovation Socket Specification and associated design documentation.

Through the Torrenza Initiative, the AMD64 computing platform
is opened for industry-wide innovation, such as connecting non-AMD accelerators
to AMD64 systems via HyperTransport technology links. Torrenza supports a range
of integration innovations from interconnections leveraging HyperTransport,
to co-processors accessing HyperTransport, to plug-in co-processors that directly
harness the speed and communications delivered by HyperTransport.