Asus recognises the fact that the latest Prescott and Smithfield processors from Intel has taken a toll on motherboard components, in terms of heat.
With this, Asus has taken steps to integrate a layer of PCB on the back of the board
for heat dissipation. Asus calls this technology Stack Cool 2, and touts that
it can reduce component tempeatures by up to 20 degrees Celsius. Unlike the original
Stack Cool Technology found on previous Asus mainboards like the P5AD2-E(925X
& XE), where the Stack Cool Layer only covers the area around the CPU, the
Stack Cool now covers the whole underside of the mainboard.

Asus has also taken the effort to maximise cooling solutions onboard without
the use of any mechanical components. As you can see in the pictures above,
apart from the Stack Cool 2 technology, Asus has also taken extra efforts to
place a nice heatsink on the MOSFETs in the PWM area. Asus has also improved
their chipset heatsink’s design and they work pretty effectively dissipating
heat, the heatsinks aren’t hot to touch to begin with after a few hours of intensive
usage. This is very unlike chipset heatsinks found on mainboards from many other
manufacturers, which can be really burning hot after a few hours of usage. That is definitely impressive when all the heat generating monsters onboard are passively cooled.