VR-Zone has gotten some concrete information on the process technology and memory interface of RV610 and RV630. Both will be based on 65nm process technology from TSMC. RV610, the low end version will only have 64-bit memory interface and we have told you earlier that there will be 2 variants at launch; RV610LE which is DDR2 based and RV610PRO which is DDR3 based. The RV610LE card has 4 layers and consumes 25W of power while RV610PRO has 6 layers and consumes 35W of power. RV630, the mainstream version will have 128-bit memory interface and comes in 3 variants; DDR4, DDR3 and DDR2. The power consumption stood at 128W, 93W and 75W respectively. There will be samples in March and expected launch in April.

VR-Zone has gotten some concrete information on the process technology and memory interface of RV610 and RV630. Both will be based on 65nm process technology from TSMC. RV610, the low end version will only have 64-bit memory interface and we have told you earlier that there will be 2 variants at launch; RV610LE which is DDR2 based and RV610PRO which is DDR3 based. The RV610LE card has 4 layers and consumes 25W of power while RV610PRO has 6 layers and consumes 35W of power. RV630, the mainstream version will have 128-bit memory interface and comes in 3 variants; DDR4, DDR3 and DDR2. The power consumption stood at 128W, 93W and 75W respectively. There will be samples in March and expected launch in April.