Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is first to market with ultra low-latency PC3 1375MHz DDR3 HyperX memory modules, driving memory benchmarking and gaming further and faster than ever before. “Our new HyperX DDR3 ultra low-latency modules give early adopters and performance enthusiasts the opportunity to push
OCZ today released PC2-6400 2GB SODIMM modules, a high-speed addition to their line of premium laptop upgrade memory. These performance memory modules are built to handle the powerful processors and other high-end components of enthusiast and professional notebooks, as well as mainstream consumers looking to add value and performance to their systems. These modules are
How does a pair of Kingston Hyper-X KHX11000D3LLK2 do on such a Hybrid DDR2/DDR3 motherboard? Rated at CAS Latency 7 and specified voltage of 1.7v, let’s take a look at this wave of new Memory Technology that is dawning…
Kingston Technology Company, Inc. today announced two USB microSD reader plus card bundles designed to enhance mobile consumers’ moving data between multiple mobile phones, PCs and digital devices. Available immediately, the new USB readers ship with either a 1GB or 2GB capacity microSD card. “Kingston saw an opportunity to serve mobile customers with our new
OCZ today announced the newest OCZ DDR3 product addition. The leading-edge PC3-10666 Platinum Edition was developed to offer the enthusiast community a solution that fully exhausts the capabilities of the Intel P35 and X38 Express chipsets. At 1333MHz, the OCZ PC3-10666 Platinum edition is rated to run CL7-7-7, featuring the ideal balance of sheer DDR3
OCZ today announced the PC2-6400 Platinum Vista Performance Edition 4GB (2x2048MB) dual channel kit. These new modules feature enhanced timings and are the ultimate upgrade for gamers transitioning their high-performance systems to Windows® Vista™. As part of OCZ’s Platinum series, the PC2-6400 4GB modules are engineered to satisfy the demands of overclockers and enthusiasts and
Kingston today announced it is shipping HyperX 1375MHz and ValueRAM 1066MHz double-data-rate three synchronous dynamic random access memory (DDR3 SDRAM) modules—the cutting edge in memory technology. Hailed as the successor to the current DDR2 memory standard, DDR3 promises significant performance gains at lower voltage levels, resulting in lower overall power consumption. Additionally, Kingston will release
Today, we bring you a sneak peek of Taiwan’s Kingston Factory. Just a little glimpse of how your memories are prepared and shipped.
VR-Zone brings you on a tour of the various memory brands and manufacturers’ booths at Computex 2007!
Corsair today unveiled the worlds fastest production DDR3 memory rated at a blazing-fast 1,600MHz (PC3-12,800) and the world preview of the Corsair DOMINATORTM memory running at 2,000MHz (PC3-16,000). Live demonstration of the new DOMINATOR memory will be on display in the Corsair VIP suite (#1334) at the Grand Hyatt Hotel. The TWIN3X2048-1600C10D DOMINATOR is the
Kingston today announced its DDR3 1066MHz memory modules have been validated on Intel reference platforms (PMO). “As Kingston prepares for the industry migration to the new DDR3 memory technology, having validation on Intel Reference Platforms is critical to indicating we have a ready solution for PC system manufacturers, motherboard builders and the early adopter community,”
OCZ today announced their official crossover into DDR3 memory to coincide with the recent launch of the Intel Bearlake Chipset. OCZ’s hand-tested DDR3 solutions enable ardent enthusiasts to take advantage of the highly-anticipated P35 platform while experiencing the legendary quality and reliability of OCZ memory. The first OCZ DDR3 products will accommodate standard JEDEC specifications
TwinMOS Technologies will introduce at booth D302-401, Hall 1, the 2.1ch miniBooM and BooM home-theatre sets for iPod®, the Global Positioning System (GPS), full memory card series, USB2.0 Mobile Disk and full DDRIII/DDRII series. In memory modules, besides the DDR2-1066, DDR2-850 and DDR2-800 of the Overclocking Series which displays the powerful R&D capacity of TwinMOS
21 of its SamsungDDR3 solutions have been validated on Intel’s reference platform to work with Intel’s next generation DDR3 chipsets. This is the largest number of DDR3-based solutions to have passed the validation program. Samsung’s Intel-validated solutions include 13 modules and eight monolithic devices in combinations of 512Mb/1Gb densities with speeds of 800 or 1066Mb/ps.
OCZ announced the OCZ PC2-8500 AMD CrossFire™ Reaper HPC Edition. As some of the highest performing modules on the market, the PC2-8500 CrossFire features the exclusive OCZ CrossFire edition Reaper HPC heatsink for advanced component cooling. These unique DDR2-1066 modules feature the Reaper HPC (Heat Pipe Conduit) heatspreader which is engineered to deliver superior silent
OCZ today unveiled a unique memory kit for AMD enthusiasts and power users. The new PC2-5400 Titanium modules were designed exclusively for the AMD AM2 platform and are custom-tailored to the extended column address range of the AM2 memory controller. With a doubled page size, access penalties are reduced to ultimately improve system performance. Used
Micron announced sample availability of the industry’s fastest main memory 1 gigabit (Gb) DDR2 components, capable of running at 1066 megabits per second (Mbps). The DDR2-1066 components are produced on Micron’s industry-leading 78-nanometer 6F² process and operate at the JEDEC standard 1.8-volts. The 1 Gb component density allows for modules in densities ranging from 512
OCZ Technology, the brand name built on overclocking and hardware enthusiasts, had a great show at CEBIT 2007, showcasing a bunch of innovative and unique items, such as the Gaming Brainwave Actuator and it’s air-water Hybrid Cooler with a carbon graphite base. Today unfortunately, instead of these interesting items, we are reviewing something more common…
Samsung has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power. The new wafer-level-processed stacked package (WSP) consists of four 512Mb DDR2 DRAM chips that offer a combined 2Gb of high density memory. Using the TSV-processed
OCZ today announced the PC2-9600 Flex XLC series. The latest edition to OCZ’s esteemed enthusiast lineup implements the proprietary Flex XLC design and is engineered to produce extreme speeds with rock-solid stability. The PC2-9600 Flex modules are guaranteed to run at 1200MHz with ease thanks to the supreme component screening and thermal management of “Flex.”