Kingston will be showcasing new and exciting additions to its full range of memory and Flash products at Computex Taipei, June 6 – 10, 2006 at the Kingston booth, B501, Hall 1. Kingston will introduce its latest memory products including HyperX DDR2 1000/1066 MHz, Kingston ValueRAM® DDR2 667/800 MHz, and fully-buffered DIMM modules. Kingston will
Yesterday, memory solutions provider Corsair announced a world-first: CL3 DDR2-800 2GB Kit going by the “Corsair Twin2x2048-6400C3″ model number. On the AM2 platform, these modules work at a blazing DDR2-800 with virgin-tight CL 3-4-2-9 timings, to become the fastest DDR2-800 kit availavble to consumers.
Corsair today announced broad availability of the world’s first production DDR2-1066 and DDR2-800 low latency 2GB kits. The new TWIN2X2048-8500C5 and the TWIN2X2048-6400C4 are optimized for the upcoming NVIDIA nForce® 590 chipset based motherboards and feature Enhanced Performance Profiles (EPP). Rated at scorching fast 1066MHz, the latest TWIN2X2048-8500C5 combines the best of high frequency performance
Corsair today announced immediate adoption of EPP. Jointly developed by Corsair and NVIDIA® as a new open memory standard, Enhanced Performance Profiles elevate memory performance by taking full advantage of the additional memory parameters that are now added to the unused portion of the JEDEC standard SPD. As a new open standard, immediate adoption by
NVIDIA announced the results of a collaborative memory development effort called Enhanced Performance Profiles, or EPP, which allows consumers to easily expose new, advanced performance memory settings built into high performance memory DIMMs for even higher levels of overall PC system performance. In addition, NVIDIA also announced today that Corsair Memory, the worldwide leader in
OCZ today announced the addition of PC2-6400 DDR2 to the Gold XTC series. OCZ Technology now offers a complete line of gamer-grade XTC DDR2 solutions ranging from DDR2-533 to DDR2-1000 to meet the demand of the impending arrival of the new AMD and Intel CPU architectures. The PC2-6400 GX XTC series offer superior stability and
OCZ today announced the first Titanium XTC products—PC-3200 EL Titanium DDR 1GB module and 2GB Dual Channel kit. The PC-3200 Titanium XTC will be available in 1GB (1024MB) modules and 2GB (2x1024MB) dual channel kits and rated to run 2-3-2-5 timings for enhanced system performance.
Samsung just announced a new method to pack more memory into small spaces — three-dimensional chip packaging. The technique works by adding “through silicon” interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology “wafer-level stack process” or WSP.
Kingston Technology Company, the independent worldwide leader in memory products, today announced the release of its new line of Fully Buffered DIMM memory modules (FB-DIMM). As the leading independent manufacturer of memory modules, Kingston made an early and strategic decision to commit major resources to support next generation memory technology like FB-DIMM thus becoming a
In the interest of supply and demand, SanDisk and Toshiba have entered a joint agreement to build a massive NAND fabrication facility in Japan. Due to the rise in demand and sales of devices such as portable MP3 players and other portable storage devices, NAND flash memory technology is clearly becoming the storage technology of
OCZ launched the PC2-5400 Platinum XTC Series with enhanced latency. By integrating 3-3-3 timings, these next generation DDR2-667 solutions are the fastest available in the PC2-5400 speed-grade. The demand for high performance DDR2 continues to mount due to the interdependence of several existing Intel platforms and the impending arrival of the new AMD and Intel
Samples of Intel’s first 65-nanometer NOR flash memory chip will be available this quarter. Mobile phone vendors will be able to start using them in large quantities by the end of the year. The new flash memory chips will be able to hold one Gb of data, up from the 512Mb of data stored by
Cypress has begun sampling the industry’s first Quad Data Rate™ II+ (QDR™ II+) and Double Data Rate II+ (DDRII+) SRAM devices. The new memory chips deliver the world’s highest-density and highest-bandwidth, enabling up to 50 percent more system-level bandwidth than existing QDRII and DDRII products. The devices accelerate read/write capabilities in a variety of data-intensive
Ryan Petersen the cool CEO of OCZ technology, confirmed that the company is preparing to ship 4GB memory kits (2 x 2GB) shortly before Microsoft Vista shows up. Those guys do believe that you will need at least 2GB of memory for the good gaming experience on Vista.
Three Samsung executives will agree to plead guilty and will serve jail time for taking part in a price-fixing conspiracy, federal prosecutors said. Sun Woo Lee, senior manager of DRAM sales, will serve eight months; Young Woo Lee, sales director for Samsung Germany, will serve seven months; and Yeongho Kang, associate director of DRAM marketing
Elpida Memory, a maker of dynamic random access memory (XDR) from Japan and also one of a few supporters of Rambus-developed XDR memory, said Wednesday that it had begun sampling of 512Mb XDR memory chips produced using 90nm process technology. The company said the demand for XDR was great and that thinner production technology would
Microsoft Windows Vista, the next generation flagship Windows software would require 512MB of RAM, according to DailyTech’s report, and 1GB to be optimum. Windows Vista will be incorporating various optimization technologies that would make use of more memory to harvest additional performance out of those extra memory. A Windows caching technique known as Superfetch, which
Samsung is the first manufacturer in the industry to begin mass producing DDR2 DRAM – 512 Megabit (Mb) – on an 80 nanometer (nm) scale. With 80-nm process technology, Samsung is able to increase its production efficiency by 50 percent over the previous 90-nm process. The production economies of scale afforded by moving to 80-nm
DailyTech reports of Micron’s acquisition of Lexar Media, a move to strengthen Micron’s memory business, especially in the NAND flash segment. "The acquisition will strengthen Micron’s position in the NAND flash business and enable the company to deliver innovative NAND flash solutions from design, development and manufacturing to marketing and sales of products to worldwide
Elpida announced the availability of its second-generation 1 Gigabit DDR2 SDRAMs and six memory modules based on the new devices. The new devices are built using Elpida’s state-of-the-art 90 nm process technology, and they complement Elpida’s full line-up of DDR2 devices that are currently in high-volume production. The x16 devices provide a wider data path