OCZ has recently introduced their DDR Booster, a device that allows for manual voltage adjustment to your motherboards VDIMM, all the way up to 3.9V. Today we take a look at this new product from OCZ and we try to break the 250MHz FSB barrier while running at 2-2-2-5 timings using the DDR Booster.
Crucial has recently introduced their Ballistix line of memory, aimed at the enthusiast markets. We take a look at their new low-latency DDR2-533 memory, running at 3-3-3-10. How does the memory perform? Come and take a look.
Samsung will start mass-producing 90nm-based DDR2 at the end of this year or the beginning of next year. Samsung is the first DRAM company to begin the transition. Samsung will initially use 90nm technology to produce 512Mbit DDR2 400, 533 and 667 components.
Kingmax has announced the release of a new generation of Kingmax Color Memory Modules using Kingmax’s advanced Color Compound technology. With extreme performance and unique exterior designs, the Kingmax Color Memory Modules are changing the face of the gaming community and turning heads throughout the entire semiconductor industry. The “KINGMAX Color Module” utilizes a breakthrough
Infineon today announced the world’s first DDR-Micro-DIMM Module for Sub-Notebooks. Infineon’s Jedec compliant Micro-DIMMs, which are only 65 per cent of the size of equal capacity SO-DIMMs used for notebooks, will further accelerate the manufacturing of lighter and smaller sub-notebooks with enhanced functionalities and battery lifetime. Micro-DIMMs have the smallest area footprint of all memory
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high-reliability memory, today announced the release of their newly-enhanced PC-4000 Gold Series. Redesigned for even faster speeds, PC-4000 Gold Series Rev. 2 offers 2.5-3-3 timings, gold layered copper heatspreaders, toll-free technical support and a lifetime warranty. The new PC-4000 Gold Edition Rev. 2 features
Elpida today announced that it will begin mass production of DDR2 SDRAM using advanced 0.10-micron process technology in August 2004. The first products slated for manufacturing utilizing 0.10-micron process technology include high-performance, high-density DRAM products such as DDR2-533 and DDR2-667. Elpida plans to increase production capacity of 0.10-micron based products to more than 50% of
Graphics Memory Technology 2004 2005 2006 XDR XDR 2.4 – 3.2Gbps 4 – 4.8Gbps XDR2 5 – 6.4Gbps GDDR GDDR3 1.2 – 1.6Gbps GDDR4 1.6 – 2.4Gbps XDR GDDR3 Clock Frequency 600Mhz 500 – 800Mhz Max. Data Rate 2.4 – 3.2Gbps/pin 1.0 – 1.6Gbps Max. Bandwidth 6.4GB/s 6.4GB/s Density 256/512MB 256MB Signaling 3.2GHz
Kingston announced today the addition new ultra low latency DDR PC3200 memory. The Kingston HyperX 400 MHz (PC3200) CL2 DDR module specifications have been updated to support lower latency timings of 2-2-2-5-1 in 512-MB memory configurations. Kingston Low-Latency HyperX Memory Modules : KHX3200UL/512 512 MB and KHX3200ULK2/1G 1-GB Kit.
Crucial today introduces the Crucial(R) Ballistix(TM) high-performance memory line, designed specifically for computer gamers and power users seeking maximum system performance and stability at a competitive price-point. The Ballistix line features both DDR and DDR2 memory with advanced speed grades, low latencies, and integrated aluminum heat spreaders. Crucials Ballistix line includes the following high-performance modules
Corsair today announced new XMS2 5300 speed modules at low latencies. Today Corsair introduced four new products in this family of ultra-fast modules. These memory modules offer the incredibly fast speeds of DDR2 5300 and the low latencies of 4-4-4-12. These come in several density options as well as in matched pairs. Developed specifically for
OCZ today announced the highly-anticipated release of their PC2-4300 Enhanced Bandwidth DDR2 Platinum Edition series. OCZ’s DDR2 533MHz products are rated at 4-3-3 timings, making them the first low-latency DDR2 memory modules available on the market today. All of OCZ Technology Group’s Enhanced Bandwidth DDR2 modules are 100% hand-tested to ensure that their quality and
Kentron 2nd generation memory product is on the way with architectural refinements that make the modules more self sustaining. QBM modules have two double-data-rate banks, running on alternating clock schedules. It stumbled in getting its initial QBM technology out the door, foiled by a bug in a key component and a lack of widespread support
Hynix today announced availability of its 1Gb based DDR2 4GB Registered Dual In-line Memory Module (RDIMM) and the industry’s first 2GB SO-DIMM for high performance server and notebook applications. The newly released modules will utilize Hynix’s 1Gb DDR2 device manufactured on the company’s leading edge 0.11-micron process technology. Hynix will plan mass production of both
Samsung Electronics today announced a wafer level packaging (WLP) technology for 512Mbit DDR2 chips that can enhance electrical properties and reduces physical space of the chips. The new package technology has two patterned inter-layer dielectrics (ILD), with insulating characteristics, and a metal layer replaces the conventional package substrate. The package enhances electrical properties though shorter
SMART announced today its new line of ultra low profile 240-pin registered DDR2 DIMMs in densities of 512MB, 1GB, and 2GB. These new 1.0″ registered memory modules are 15 percent lower in height than industry-standard PC2-3200 and PC2-4300 DIMMs. SMART’s DDR2 modules operate at system clock speeds of 200MHz and 267MHz with data transfer rates
OCZ today announced the release of the DDR Booster, a power-filtering and voltage boost diagnostic device. The OCZ DDR Booster is compatible with all first generation DDR platforms. The DDR Booster uses OCZ’s patent pending Powerclean™ technology to supply cleaner power to the memory module, thereby increasing memory stability and optimizing performance. A digital VDIMM
Micron today announced validation of its 1Gb DDR components and 4GB DDR Registered DIMM modules for the AMD Opteron(TM) processor. Validation of these components and modules enables AMD Opteron processor customers to choose DDR registered DIMMs in all densities, including 256MB to 4GB, and at all speed grades, including PC2100, PC2700, and PC3200.
Corsair today announced a new family of “XL” memory modules that supports 2-2-2-5 latencies at 400MHz, making the XL family the highest performing PC3200 memory in the world. The new XL product family inclues the following products: TwinX1024-3200XLPRO matched pair of 512MB, DDR400, 2-2-2-5, XMS Pro Series modules TwinX1024-3200XL matched pair of 512MB, DDR400, 2-2-2-5,
OCZ today announced the impending release of high their performance PC2-4300, PC2-5300 and PC2-6400 Enhanced Bandwidth DDR-II module family. OCZ will be testing all DDR-II modules and dual channel kits to ensure maximum stability and functionality at specified clock frequencies and latency settings. While DDR-II platforms are still in development, we expect major chipset manufacturers