Apogee GT 1150 thumb Chaintech Unveiled APOGEE GT DDR2 1150 &1200 4GB Kit

Walton Chaintech introduces its new APOGEE GT DDR2 1150 and 1200 memory
module 4GB KIT (2GB x 2 pc). It is specifically designed
to be made with 8-layer PCBA and dual-channel configuration support and a
latency of CL 5-5-5-15. The famous fin-shape heatsink with a touch of APOGEE red
is featured with each pair of modules and helps reducing the heat during the
overclocking operation and increase stability of this pair of memory modules.

Apogee GT 1150 Chaintech Unveiled APOGEE GT DDR2 1150 &1200 4GB Kit

Walton Chaintech, the world’s renowned memory module and graphic card
manufacturer, introduces its new APOGEE GT DDR2 1150 and 1200 memory module 4GB
KIT (2GB x 2 pc) facilitating customers with more competitive price, high
capacity and efficiency.

APOGEE GT DDR2 1150 and 1200 memory module 4GB KIT is specifically designed
to be made with 8-layer PCBA with strictly refined quality and JEDEC
standardized stability. In terms of bandwidth and speed enhancement, the
bandwidth of APOGEE GT DDR 1150 has been expanded to 9.6 GB/s. A 50% growth is
performed compared with the current mainstream DDR2 800 (6.4 GB/s).

With dual-channel configuration support and a latency of CL 5-5-5-15, APOGEE
GT DDR2 1150 and 1200 clearly position itself at the top level of speed and
performance among other overclocking memory modules. The famous fin-shape
heatsink with a touch of APOGEE red is featured with each pair of modules and
helps reducing the heat during the overclocking operation and increase stability
of this pair of memory modules.

APOGEE GT DDR2 1150 and 1200 modules use top quality 128M x 8 BGA chips, with
a highest capacity reaching 4 GB in size for faster graphics rendering, 3D
gaming, and performance computing. In this 4GB kit, two 2GB modules are included
with guaranteed compatibility and occupy less memory slots for better space
management.

All chips on the APOGEE GT DDR2 1200 memory modules undergo strict sorting
and required to complete a high temperature burn-in test with the most advanced
process at the second largest memory packaging and testing companies to meet our
published specifications.