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Chaintech Unveiled APOGEE GT DDR2-1150 &1200 4GB Kit

Reported by on Tuesday, April 29 2008 2:06 pm

Walton Chaintech introduces its new APOGEE GT DDR2 1150 and 1200 memory module 4GB KIT (2GB x 2 pc). It is specifically designed to be made with 8-layer PCBA and dual-channel configuration support and a latency of CL 5-5-5-15. The famous fin-shape heatsink with a touch of APOGEE red is featured with each pair of modules and helps reducing the heat during the overclocking operation and increase stability of this pair of memory modules.

Walton Chaintech, the world’s renowned memory module and graphic card manufacturer, introduces its new APOGEE GT DDR2 1150 and 1200 memory module 4GB KIT (2GB x 2 pc) facilitating customers with more competitive price, high capacity and efficiency.

APOGEE GT DDR2 1150 and 1200 memory module 4GB KIT is specifically designed to be made with 8-layer PCBA with strictly refined quality and JEDEC standardized stability. In terms of bandwidth and speed enhancement, the bandwidth of APOGEE GT DDR 1150 has been expanded to 9.6 GB/s. A 50% growth is performed compared with the current mainstream DDR2 800 (6.4 GB/s).

With dual-channel configuration support and a latency of CL 5-5-5-15, APOGEE GT DDR2 1150 and 1200 clearly position itself at the top level of speed and performance among other overclocking memory modules. The famous fin-shape heatsink with a touch of APOGEE red is featured with each pair of modules and helps reducing the heat during the overclocking operation and increase stability of this pair of memory modules.

APOGEE GT DDR2 1150 and 1200 modules use top quality 128M x 8 BGA chips, with a highest capacity reaching 4 GB in size for faster graphics rendering, 3D gaming, and performance computing. In this 4GB kit, two 2GB modules are included with guaranteed compatibility and occupy less memory slots for better space management.

All chips on the APOGEE GT DDR2 1200 memory modules undergo strict sorting and required to complete a high temperature burn-in test with the most advanced process at the second largest memory packaging and testing companies to meet our published specifications.



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