VR-Zone.com finds itself back in TAIPEI 101, to attend the GIGABYTE Technology Seminar. Find out more about GIGABYTE mainboards, Unlocked Power, HotKey OC, Cloud OC, and 3x USB Power.
02 June 2010 – VR-Zone.com finds itself back in TAIPEI 101, to attend the GIGABYTE Technology Seminar. Besides having a booth at Taipei World Trade Center (TWTC) Exhibition Hall 1 this COMPUTEX, GIGABYTE also occupies the 36th floor of the world’s second tallest skyscraper (by architectural detail) to showcase new products and upcoming developments. Stepping into TAIPEI 101, things looked a little quiet at first.
It turned out that members of the press had already made their way into the Conference Center, and were busily snapping away.
Welcoming the press was Mr. Henry Kao, Vice President of GIGABYTE’s Motherboard Business Unit.
Mr. Kao took the opportunity to praise GIGABYTE for spearheading SuperSpeed USB (USB 3.0) adoption on PC mainboards. He was also happy about the availablity of USB 3.0 on GIGABYTE’s existing mainboard product lineup, citing USB 3.0 implementation “from our flagship GA-X58A-UD9 motherboard, down to the value oriented GA-EP41T-USB3.”
Still, what proof was there of GIGABYTE’s success with SuperSpeed USB mainboards?
“We sold more USB 3.0 enabled motherboards than any of our competitors,” announced Mr. Kao. You could hear the collective sound of journalists striking that potential question off their scribbly notepads. Next up in the limelight was Dr. Zane Ball, Director, Intel Desktop Marketing.
Dr. Ball was at the GIGABYTE Technology Seminar to talk about the newly launched Intel® Core™ i7-875K, and Intel® Core™ i5-655K CPUs, targetted at enthusiasts who are using Intel’s mainstream platforms and have yet to maximise the overclocking potential of their systems. “With our new unlocked K-sku CPUs,” said Dr. Ball, “they too can enjoy the benefits of overclocking.” Mainboards built for high Base Clock overclocking, and CPUs made with unlocked multipliers, are a match made in heaven; this was the point being driven across, and clearly so.
Deputy Director of Motherboard Marketing, Mr. Tim Handley, took charge of the New Technology & Product Information Update presentation. Reiterating the compatibility of GIGABYTE Intel® P55 Express mainboards and the new Intel® “unlocked” CPUs, Mr. Handley was happy to note that, as of May 2010, GIGABYTE Intel® P55 Express mainboards took up over a third (34%) of Intel® P55 Express submissions on HWBot.org.
Mr. Handley also took the opportunity to unveil a number of product updates – the first of which was GIGABYTE “Unlocked Power.”
Those of you who have been with us long enough might remember that we used to (back in the early 2000s) pay a lot of attention to the Voltage Regulator Module (VRM) layout on mainboards and graphics accelerators that were sent in for review. This was in part due to the extensive overclocking tests VR-Zone.com performed on these review units, as well as the relatively poor reliability of Do-It-Yourself (DIY) PC hardware in those days. I remember advocating the importance of quality power components, and sufficient power margins on numerous occasions back then.
Circa Q1’04, “Prescott” Intel® Pentium® 4 Processors built on high leakage 90nm lithography started killing mainboards designed for lower Thermal Design Power (TDP), lower leakage, 130nm lithography “Northwood” Intel® Pentium® 4 Processors. This finally made the industry sit up and take notice of the importance of VRM design. Forward compatiblity was clearly not a simple case of updating CPU microcode over BIOS releases. From our archives, we found something from GIGABYTE that probably started the CPU VRM “phase-race” we see today – something that was born in the same vein as the GIGABYTE Unlocked Power being introduced today.
Dual Power System (DPS) addon cards like these are no longer relevant for today’s VRM switching frequencies and CPU power draw. What Mr. Handley was introducing instead – “Unlocked Power,” is the marketing behind GIGABYTE’s CPU VRM implementation on their recent mainboard lineup. At this point, the GIGABYTE GA-X58A-UD9 flagship best represents what Unlocked Power is all about – delivering “Maximum Power” to the CPU. In-house tests have shown that the GIGABYTE GA-X58A-UD9 can supply approximately 1500W of power to the CPU via its FCLGA1366 socket. You can see more in the promotional video below:
Mr. Handley then questioned the audience about the maximal TDP ratings of current generation Intel® FCLGA1366 CPUs. “130W,” replied the press.
Here you see Mr. Handley reeling from the sheer force of “Unlocked Power.”