Corsair today unveiled the
latest innovation in high performance module design, Dual-path Heat
Xchange (DHX) technology. This performance and reliability
enhancing technology will be available in the latest memory product line
from Corsair also launched today, the DHX XMS2 DOMINATOR Series. The
advances provided by DHX enable the world’s first PC2-8888 C4 (1111MHz
at CAS Latency 4) speed rating on a production pair of 1 GByte modules. The DHX XMS2 DOMINATOR PC2-8888 C4 module will also feature a Corsair
DOMINATOR Airflow fan that provides vastly increased air circulation
through the module heat sink. To complement the launch of the PC2-8888
module Corsair will also offer a lower cost PC2-8500 C5 module for
customers who want the added features of DHX without requiring the
additional speed boost provided by the PC2-8888 C4 solution.

image010 Corsair Introduces Dual path Heat Xchange (DHX) Memory Technology

At launch the DHX XMS2 DOMINATOR modules will be offered in two speed
grades: PC2-8888 1111MHz 2x1GB CL4 Modules & PC2-8500 1066MHz 2 x 1GB CL5
Modules.

Corsair today unveiled the
latest innovation in high performance module design, Dual-path Heat
Xchange (DHX) technology.  This performance and reliability
enhancing technology will be available in the latest memory product line
from Corsair also launched today, the DHX XMS2 DOMINATOR Series. The
advances provided by DHX enable the world’s first PC2-8888 C4 (1111MHz
at CAS Latency 4) speed rating on a production pair of 1 GByte modules. The DHX XMS2 DOMINATOR PC2-8888 C4 module will also feature a Corsair
DOMINATOR Airflow fan that provides vastly increased air circulation
through the module heat sink.  To complement the launch of the PC2-8888
module Corsair will also offer a lower cost PC2-8500 C5 module for
customers who want the added features of DHX without requiring the
additional speed boost provided by the PC2-8888 C4 solution.
 

image010 Corsair Introduces Dual path Heat Xchange (DHX) Memory Technology

Dual-path Heat Xchange (DHX) is the world’s most advanced memory
module thermal dissipation technology. This Patent Pending heat sink
technology substantially increases the memory module’s thermal
dissipation so that the heat generated by the RAM cells can be more
efficiently removed from the module.  RAMs that run at lower
temperatures enjoy improved performance and extended reliability.

Since traditional heat spreaders are only attached to the back surface
of the memory packages there is no direct thermal path for the heat
coming from the surface of the RAMs to escape through.  The new
Dual-Path Heat Xchange (DHX) technology developed by Corsair engineers
uses two paths for the heat to escape from a memory device. The innovative first
path is through the leads of the BGA chips into the
printed circuit board (PCB).  When BGA devices are soldered on to a
memory module, an all-metal thermal path is created from the surface of
the RAM to the copper ground plane of the PCB. This thermal path
provides very efficient heat removal. In fact, a study by Micron
Semiconductor (application note TN-00-08) indicated that well over half
of the heat generated by a memory module is removed in this manner.

In order to maximize the performance of this thermal path, a special PCB
was constructed. The height of this PCB was extended to allow
installation of a dedicated heat sink. This heat sink is used to
dissipate the heat generated by the RAMs on the module which has been
conducted into the copper ground plane of the PCB. The second, more typical
thermal path is through the back of the BGA
packages and into high-performance extruded aluminum heat sinks.
Overall, the module has four heat sinks, two connected to the RAMs and
two connected to the PCB. These heat sinks were designed specifically
for the personal computing environment, with fins oriented both in
latitudinal and longitudinal orientation to take advantage of air
provided by CPU fans as well as case fans.  The result is a module with
superior thermal characteristics that will run cooler than a module with
stamped or mesh heat spreaders, and thus have greater reliability and
over-clocking capability.

The thermal design of the DOMINATOR module is optimized for the use of
impinging airflow. Forced air from directly above the module can be used
to further enhance the performance of the module.  Corsair has developed
a DOMINATOR Airflow fan which is designed to be matched with the
DOMINATOR heat sinks and allow even more heat to be removed from the DHX
XMS2 DOMINATOR modules. This fan unit contains three 40mm
tachometer-controlled fans to provide impinging airflow to the memory
subsystem.  The moderate RPMs required to provide adequate forced air
mean the DOMINATOR Airflow fan is nearly silent.

The DOMINATOR heat sink assemblies using DHX technology, with the
addition of DOMINATOR Airflow, allows Corsair to guarantee module
reliability at over 2.5 volts (2.4 volts, +/- 5%).  The combination of
this extended voltage and reduced operating temperature allows Corsair
to offer modules guaranteed to perform at PC2-8888, or 1,111 MHz, at CAS
4 settings.

As with all other new Corsair XMS modules, the DHX XMS2 DOMINATOR
modules are also shipped with Enhanced  Performance Profiles (EPP), the
new open standard for the Serial Presence Detect (SPD) jointly developed
by NVIDIA and Corsair.  EPP simplifies over-clocking for novice
enthusiasts and provides unparalleled control for experts.

The new DHX XMS2 DOMINATOR Series and the DOMINATOR Airflow accessory
will be available at retailers by the first week of September.  Expected
retail prices for these modules are from USD$ 600-$ 650 for the
TWIN2X2048-8888C4DF and USD$ 380-$ 400 for the TWIN2X2048-8500C5D. The
DOMINATOR Airflow is expected to retail for under USD$ 25.00.

At launch the DHX XMS2 DOMINATOR modules will be offered in two speed
grades:  PC2-8888 1111MHz 2x1GB CL4 Modules & PC2-8500 1066MHz 2 x 1GB CL5
Modules.