Elpida today announced that it will begin mass production of DDR2 SDRAM using advanced 0.10-micron process technology in August 2004. The first products slated for manufacturing utilizing 0.10-micron process technology include high-performance, high-density DRAM products such as DDR2-533 and DDR2-667. Elpida plans to increase production capacity of 0.10-micron based products to more than 50% of their 300 mm wafer line capacity by January 2005.

Elpida today announced that it will begin mass production of DDR2 SDRAM using
advanced 0.10-micron process technology in August 2004. The first products
slated for manufacturing utilizing 0.10-micron process technology include
high-performance, high-density DRAM products such as DDR2-533 and DDR2-667.

"Elpida strives to offer the industry stable production of high-performance
DRAM products," said Yukio Sakamoto, president of Elpida Memory. "Our ability to
mass manufacture 0.10-micron DRAM enables us to meet increased demand for
advanced DDR2 SDRAM as the industry transitions from DDR to DDR2 architecture."

Elpida plans to increase production capacity of 0.10-micron based products to
more than 50% of their 300 mm wafer line capacity by January 2005.