Elpida Cu DDR3 thumb Elpida Developed Fastest DDR3 Chips

Elpida had developed the world’s first 2.5Gbps1Gb DDR3 SDRAM. The new memory device has an optimized
design based on a copper interconnect process and new circuit technology that
not only enables faster speeds but also an ultra-low voltage operation of 1.2V
while conforming to DDR3 specifications. It achieves data
rates of 2.5Gbps at 1.5V and 1.8Gbps at 1.2V, considerably faster than the
current industry standard of 1.6Gbps at 1.5V.

Elpida Cu DDR3 Elpida Developed Fastest DDR3 Chips

Elpida Memory today announced that it had developed the world’s first 2.5Gbps
(bit per second) 1-gigabit DDR3 SDRAM. The new memory device has an optimized
design based on a copper interconnect process and new circuit technology that
not only enables faster speeds but also an ultra-low voltage operation of 1.2V
while conforming to DDR3 specifications.

In upgrading a system’s overall performance it is important to strike a balance
between the data transfer rate and power consumption. Server and PC makers who
use DDR3 are increasingly demanding the freedom to choose an optimum data rate
and a supply voltage that can meet various kinds of system requirements. In
response to this demand Elpida’s new SDRAM can meet DDR3 standard 1.5V as well
as ultra-low 1.35V and 1.2V voltage requirements. In addition, it achieves data
rates of 2.5Gbps at 1.5V and 1.8Gbps at 1.2V, considerably faster than the
current industry standard of 1.6Gbps at 1.5V.

Key features of the new DDR3 SDRAM:

Characteristics that achieve a next-generation DDR3 data rate over a range of
voltages

  • Data rate: 667Mbps-2.5Gbps; voltage: 1.2V-1.5V
  • Common-die solution for fast operating speed and ultra-low voltage
    operation
  • One chip enables a wide range of operating voltages and operating speeds
    suited not only to new low-voltage/high-speed systems but is also compatible
    with existing standard 1.5V systems. A product that meets customer demand
    for all kinds of system designs.
  • 25% faster than products with aluminum interconnects and consumes as
    much as 22% less power.

The new DDR3 SDRAM uses a copper interconnect process that is superior to
aluminum in terms of transmission characteristics. By taking maximum advantage
of these characteristics during the design phase new circuitry can be developed
that enables even faster products that continue to need little power. As a
result, the new product’s ability to operate at an ultra low voltage of 1.2V can
contribute to lower power consumption, which is especially important in the case
of large-memory capacity extended-use server applications. Also, for high-end
PCs geared to high-speed operations an operational speed of 2.5Gbps enables a
significant system performance upgrade.

The new copper interconnect-based DDR3 SDRAM is intended for applications in the
areas of servers and high-end PCs. Sample shipments are scheduled to begin by
the end of August. Also, Elpida plans to use a process shrink to enable the new
memory product to achieve even faster speeds and lower voltage.