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HIS Unveiled Radeon HD 3850 IceQ 3 TurboX

HIS today unveils the HIS Radeon™ HD 3850 IceQ 3 TurboX (Full HD 1080p) 512MB
GDDR3 (Limited Edition) card, features extra turbo speed and equipped with the
latest IceQ 3 cooling solution.
HIS Radeon™ HD 3850 IceQ 3 TurboX (Full HD 1080p) 512MB GDDR3 (Limited Edition)
card featured with 666 million transistors on 55nm fabrication process! Its
powered by a chipset with core speed up to 735MHz and memory speed up to
1960MHz, which make it the fastest 3850 model in the World!

HIS today unveils the HIS Radeon™ HD 3850 IceQ 3 TurboX (Full HD 1080p) 512MB
GDDR3 (Limited Edition) card, features extra turbo speed and equipped with the
latest IceQ 3 cooling solution. It delivers the next generation of HD graphics
with strikingly fast gaming performance, and support for the latest Microsoft®
DirectX® 10.1 gaming environment.

HIS Radeon™ HD 3850 IceQ 3 TurboX (Full HD 1080p) 512MB GDDR3 (Limited Edition)
card featured with 666 million transistors on 55nm fabrication process! Its
powered by a chipset with core speed up to 735MHz and memory speed up to
1960MHz, which make it the fastest 3850 model in the World!

Together with HIS latest IceQ 3 cooling technology, it allows you maintain
stunning speeds at an ideal temperature and sound level without sacrificing any
of the performance. Youll be blown away by life-like graphics from the latest
Microsoft® DirectX® 10.1 and Shader Model 4.1, with stunning 3D graphics and
shading effects. Taking advantage of the ATI PowerPlay™ technology, the ATI
Radeon™ HD 3800 Series delivers up to twice the performance per dollar of
previous generations of AMD GPUs. With 320 stream processors and PCI Express®
2.0 support, you’re ready for the most demanding titles. And thanks to
plug-and-play ATI CrossFireX™ upgradeability, it is easy to turbo-charge your 3D
performance.

HIS IceQ 3 The best air cooling solution

  • HIS IceQ 3 is the 3rd generation of IceQ cooling technology which is
    endorsed by worldwide media. HIS IceQ 3 innovative design doubles the
    strength of its predecessor.
  • Innovative design: Significantly improves cooling performance and
    reduces weight.
  • Heatpipe with sintered powder wicks: Heat is rapidly transferred from
    the core area reducing the GPU temperature.
  • Isolated heatsinks: Memory and GPU heatsinks are completely separated,
    preventing any heat transfer from GPU to memory.
  • Bi-directional air in-take channels: Cool air is drawn from both sides
    of the fan. Improving airflow. This ensures effective cooling even for
    CrossFire platform.
  • Ultra silent and durable fan: Significantly reduced noise level and
    extended service lift.
  • Dual-slot cooling design: Directly exhausts hot air out of PC case

TeamVR
http://vrzone.com
VR-Zone is a leading online technology news publication reporting on bleeding edge trends in PC and mobile gadgets, with in-depth reviews and commentaries.

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