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IBM 300mm, 90nm Yields Improve

IBM’s 300mm foundry yields have made a significant upswing in the past two months, closing the gap between IBM’s initial road map and its actual yield. 300mm fab in East Fishkill, N.Y., currently is generating about two-thirds of the number of chips it can produce if yield was close to 100 percent. But that’s a significant increase over where it was two months ago. IBM will introduce its Power5 architecture this quarter at 130nm with a third-generation dual core, multithreading in each core and dynamic power management. Power5 is a 130-nm chip, based on silicon-on-insulator (SOI) and copper interconnects. The Power5 chip has 276 million transistors, compared to 174 million in the Power4. IBM claims to have an inherent advantage in areas such as power management because of the breadth and depth of its product portfolio.

IBM’s 300mm foundry yields have made a significant upswing in the past two months, closing the gap between IBM’s initial road map and its actual yield. 300mm fab in East Fishkill, N.Y., currently is generating about two-thirds of the number of chips it can produce if yield was close to 100 percent. But that’s a significant increase over where it was two months ago. IBM will introduce its Power5 architecture this quarter at 130nm with a third-generation dual core, multithreading in each core and dynamic power management. Power5 is a 130-nm chip, based on silicon-on-insulator (SOI) and copper interconnects. The Power5 chip has 276 million transistors, compared to 174 million in the Power4. IBM claims to have an inherent advantage in areas such as power management because of the breadth and depth of its product portfolio.

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