IBM, GlobalFoundries and Samsung to Present Next-Generation Chip Technology in March
Three players joined in the largest foundry alliance – the Common Platform Alliance will present next generation silicon at the 2012 Common Platform Technology Forum in Santa Clara, California.
With all the news about the changes in manufacturing with its clients (AMD is now a customer with all three major vendors), it is easy to forget that three major players are actually in an alliance, jointly working on technology development.
We have received news that on March 14, just a week after CeBIT 2012 in Germany – IBM, GlobalFoundries and Samsung Electronics will host the 2012 Common Platform Technology Forum in Santa Clara, California.
The topics are mighty impressive – "previewing the future of silicon technology", as the press release put it. On the conference, the mayor players will answer the questions put forward in terms of 28nm, 20nm and 14nm processes, the upcoming conversion to 450mm wafers (34% larger wafer than current 300mm).
Besides IBM/GlobalFoundries/Samsung Electronics triangle, there will be between 20 and 30 additional member companies which create chips that end up in "majority of world's mobile devices and consumer electronics."