Scientists at IBM’s research laboratory here have devised a method of liquid cooling of semiconductors using a direct jet- impingement technique that deploys an array of tiny nozzles and a distributed return architecture. Recent experiments with the immersed jet impingement technique have shown cooling power densities of up to 370W/cm2 with a single phase water cooler. The current limit of most air cooling technologies now in use is about 60 W/cm2, and most chip makers will stick with air cooling techniques until other alternatives being researched can be shown to be more cost effective. As well as liquid jet impingement cooling, the team at Zurich is also looking into miniaturized convective cooling.


Scientists at IBM’s research laboratory here have devised a method of liquid cooling of semiconductors using a direct jet- impingement technique that deploys an array of tiny nozzles and a distributed return architecture. Recent experiments with the immersed jet impingement technique have shown cooling power densities of up to 370W/cm2 with a single phase water cooler. The current limit of most air cooling technologies now in use is about 60 W/cm2, and most chip makers will stick with air cooling techniques until other alternatives being researched can be shown to be more cost effective. As well as liquid jet impingement cooling, the team at Zurich is also looking into miniaturized convective cooling.