IDF: Intel Sandy Bridge silicon exposed
The integrated heatspreader on Intel’s upcoming Sandy Bridge has come off at the Intel Developer Forum 2010; what we are looking at here is the actual silicon. Unlike the previous generation Core i3 and Core i5, Sandy Bridge integrates the CPU, graphics, and memory controller all onto a single die.
Steve Smith from Intel holds the ‘Sandy Bridge’ next-generation processor
The integrated heatspreader has been removed and we are able to see a rectangular die. This is different from the current generation Core i3 and Core i5 processors where there are two separate dies – a 32nm processor die, and a 45nm integrated graphics controller / memory controller die. Sandy Bridge integrates the CPU, graphics, and memory controller all onto a single package.
And no, nothing on Cougar Point supporting USB 3.0 yet.
We also have a still shot of the Intel Sandy Bridge processor published by Engadget earlier on.
References: Intel Channel and Engadget