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IDF: Intel Sandy Bridge silicon exposed

The integrated heatspreader on Intel’s upcoming Sandy Bridge has come off at the Intel Developer Forum 2010; what we are looking at here is the actual silicon. Unlike the previous generation Core i3 and Core i5, Sandy Bridge integrates the CPU, graphics, and memory controller all onto a single die.

Steve Smith from Intel holds the ‘Sandy Bridge’ next-generation processor

The integrated heatspreader has been removed and we are able to see a rectangular die. This is different from the current generation Core i3 and Core i5 processors where there are two separate dies – a 32nm processor die, and a 45nm integrated graphics controller / memory controller die. Sandy Bridge integrates the CPU, graphics, and memory controller all onto a single package.

And no, nothing on Cougar Point supporting USB 3.0 yet.

 

We also have a still shot of the Intel Sandy Bridge processor published by Engadget earlier on.

 

References: Intel Channel and Engadget

 

TeamVR
http://vrzone.com
VR-Zone is a leading online technology news publication reporting on bleeding edge trends in PC and mobile gadgets, with in-depth reviews and commentaries.

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