Infineon today announced that it has shipped first samples of its 2GB DDR2 Planar Registered DIMMs. The modules use single-die 512Mbit DDR2 memory chips in very compact FBGA packages and are based on a planar design. Currently available modules with densities greater than 1 GB use stacked-die. Infineon’s new planar solution for 2 GB modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation. This new 2 GB Registered DIMM uses 36 single-die 512 Mbit DDR2 components in JEDEC compliant 60-ball FBGA packages which operate at speeds of 400 Mbit/s and 533 Mbit/s. Samples of the 2 GB DDR2 Planar Registered DIMM are available in an organization of 256 Mbit x 72 (2 Rank x4), for speeds of PC2-3200 and PC2-4300 at unit prices from US-Dollar 700 to 910. Volume production is planned to start in the second half of calendar year 2004.

Infineon Infineon 2GB DDR2 Planar Registered DIMM

Infineon today announced that it has shipped first samples of its 2 Gigabyte
(GB) DDR2 Planar Registered Dual Inline Memory Modules (DIMMs). The modules use
single-die 512 Megabit (Mbit) DDR2 memory chips in very compact Fine-Pitch Ball
Grid Array (FBGA) packages and are based on a planar design. Currently available
modules with densities greater than 1 GB use stacked-die. Infineon’s new planar
solution for 2 GB modules is based on mature single-die components. System
manufacturers will benefit from considerably flatter modules which with a
thickness of 4.1 mm fulfil the requirements for DDR2 server applications and
depending on the respective system configuration result in up to 10 percent
reduced heat generation.

The 2 GB DDR2 Planar Registered DIMM, which is expected to become the preferred
density of high-end server suppliers, targets high-performance data processing
and storage applications in the server and storage infrastructure market.
According to market research firm iSuppli the demand for mid-end and high-end
servers units will increase from around 800,000 units in 2003 to approx. 1
million units in 2006 with an average growth rate of 9 percent per year.

“The successful deployment of single-die components in a planar high-density
memory module solution once again underlines Infineon’s technology leadership
and sets new standards for next generation memory,” said Dr. Carsten Gatzke,
Senior Director Commodity DRAM Marketing at Infineon Technologies. “This
innovative technology reduces complexity in component design, increases
flexibility in product allocation and allows Infineon to efficiently respond to
changing customer requirements in one of our focus markets – servers,
workstations and storage systems.”

This new 2 GB Registered DIMM uses 36 single-die 512 Mbit DDR2 components in
JEDEC (Joint Electronic Device Engineering Council) compliant 60-ball FBGA
packages which operate at speeds of 400 Mbit/s and 533 Mbit/s. With the
introduction of the 2 GB DDR2 Planar Registered DIMM, Infineon optimizes its
DDR2 standard portfolio of registered modules with memory densities of 256 MB,
512 MB, 1 GB, 2 GB and 4 GB. Each DIMM except the 4 GB module is based on a
planar design.

Price and Availability

Samples of the 2 GB DDR2 Planar Registered DIMM are available in an organization
of 256 Mbit x 72 (2 Rank x4), for speeds of PC2-3200 and PC2-4300 at unit prices
from US-Dollar 700,- to 910,-. Volume production is planned to start in the
second half of calendar year 2004.