Infineon unleashed a number of high-density memory products for notebook and
graphics markets. For high-end notebooks, Infineon released engineering samples
of 2GB dual-die based DDR2 SO-DIMMs which achieve the 2GB capacity using a form
factor thickness of 3.8 mm and also 1GB versions of its DDR2 Micro-DIMM line for
subnotebook computers.

 Infineon also expanded its graphics memory portfolio to include 512Mbit
GDDR3 memory with the increased density and bandwith needed for advanced 3D-
graphics. The GDDR3 16Mbit x 32 components have a clock frequency of 800 MHz,
enabling data bandwidths of up to 51.2Gbit/s per memory. The GDDR3 provides
clock frequencies of up to 800MHz at an operating voltage of 1.9V. The package
is a JEDEC compliant 136-ball FBGA package with 11mm x 14mm x 1.2mm dimensions.
Samples are shipping now.

Infineon unleashed a number of high-density memory products for notebook and
graphics markets. For high-end notebooks, Infineon released engineering samples
of 2GB dual-die based DDR2 SO-DIMMs which achieve the 2GB capacity using a form
factor thickness of 3.8 mm and also 1GB versions of its DDR2 Micro-DIMM line for
subnotebook computers.

 Infineon also expanded its graphics memory portfolio to include 512Mbit
GDDR3 memory with the increased density and bandwith needed for advanced 3D-
graphics. The GDDR3 16Mbit x 32 components have a clock frequency of 800 MHz,
enabling data bandwidths of up to 51.2Gbit/s per memory. The GDDR3 provides
clock frequencies of up to 800MHz at an operating voltage of 1.9V. The package
is a JEDEC compliant 136-ball FBGA package with 11mm x 14mm x 1.2mm dimensions.
Samples are shipping now.