Infineon today announced the world’s first DDR-Micro-DIMM Module for
Sub-Notebooks. Infineon’s Jedec compliant Micro-DIMMs, which are only 65 per
cent of the size of equal capacity SO-DIMMs used for notebooks, will further
accelerate the manufacturing of lighter and smaller sub-notebooks with enhanced
functionalities and battery lifetime. Micro-DIMMs have the smallest area
footprint of all memory modules at the same densities, and are an ideal solution
for sub-notebooks. Infineon has already secured its first design wins for the
Micro-DIMM products, and was chosen as a preferred supplier by Asus, the world’s
largest manufacturer of computer motherboards.

Samples of the Micro-DIMMs are available now for speeds of PC2-3200 and
PC2-4300. The 256MB Micro-DIMMs are available at typical pricing of US-Dollar 80
to US-Dollar 100, 512MB densities are available from US-Dollar150 to US-Dollar
170, and prices for 1GB Micro-DIMMs are available on request. Volume production
of 256MB and 512MB Micro-DIMMs is planned to start in September 2004, and 1GB
Micro-DIMMs are expected to be in volume production in 2005.

Infineon Infineon DDR2 Micro DIMMs

Infineon today announced the world’s first DDR-Micro-DIMM Module
for Sub-Notebooks. Infineon’s Jedec compliant Micro-DIMMs, which are only 65 per
cent of the size of equal capacity SO-DIMMs (Small Outline DIMMs) used for
notebooks, will further accelerate the manufacturing of lighter and smaller
sub-notebooks with enhanced functionalities and battery lifetime. Micro-DIMMs
have the smallest area footprint of all memory modules at the same densities,
and are an ideal solution for sub-notebooks. Infineon has already secured its
first design wins for the Micro-DIMM products, and was chosen as a preferred
supplier by Asus, the world’s largest manufacturer of computer motherboards.

Weighing only around 1 kg (kilogram), or 2,2 pounds, which is about one-fourth
the weight of conventional notebooks, sub-notebooks combine the advantages of
such handheld devices as PDAs with professional mobile computing capabilities.
According to market research firm Gartner Dataquest, sub-notebooks are expected
to constitute 17 per cent of the notebook market, with 9.4 million units sold
per year, by 2007.

To offer sub-notebooks with increased functionalities and feature options, such
as DVD drives, the space for standard components such as memory needs to be
reduced, driving the need for innovative module design. Until now, DDR2-based
notebooks have used SO-DIMMs with 200 pins, a form factor that limits the use of
the modules in smaller sub-notebooks. Micro-DIMMs are manufactured using a new
214-pin “mezzanine connector” technique that reduces the size of the module and
the area covered by the connector by about 40 per cent compared to currently
available SO-DIMMs. While a combination of on-board memory and one Micro-DIMM
slot will be sufficient to answer the memory needs of most sub-notebooks, the
memory can be further increased by incorporating two module slots. Additionally,
the use of low-power DDR2 components will reduce the power consumption of the
module by approximately 50 percent, contributing to either extended battery life
or allowing battery size reduction in the sub-notebook.

“Expanding our memory products portfolio with DDR2 Micro-DIMMs emphasizes our
‘One-Stop-Shopping Strategy’ for all kinds of memory needs,” said Dr. Carsten
Gatzke, Senior Director Marketing of Infineon’s Commodity Memory Products
Business Group. “This innovative, industry-leading technology reduces space,
increases notebook designers’ flexibility and addresses changing customer
requirements in the mobile computing market.”

Technical Information on the Micro-DIMM

Infineon’s Jedec (Joint Electronic Device Engineering Council) compliant Micro-DIMM
portfolio includes modules with 256MB (megabyte), 512MB and 1GB (gigabyte)
densities. The small module PCB (printed circuit board) size is achieved with
Infineon’s small-size, single-die 512Mb (megabit) and 1Gb (gigabit) DDR2 memory
components in compact Fine-Pitch Ball Grid Array (FBGA) packages. The 256MB and
512MB Micro-DIMMs use 4 and 8 single-die 512Mb DDR2 components, respectively.
The Jedec compliant 60-ball FBGA packages operate at speeds of 400 Mbps
(megabits per second) and 533 Mbps. The 1GB module uses 8 single-die 1Gb DDR2
components, and will complete the DDR2 Micro-DIMM portfolio.

Price and Availability

Samples of the Micro-DIMMs are available now for speeds of
PC2-3200 and PC2-4300. The 256MB Micro-DIMMs are available at typical pricing of
US-Dollar 80 to US-Dollar 100, 512MB densities are available from US-Dollar150
to US-Dollar 170, and prices for 1GB Micro-DIMMs are available on request.
Volume production of 256MB and 512MB Micro-DIMMs is planned to start in
September 2004, and 1GB Micro-DIMMs are expected to be in volume production in
2005.