Intel is outfitting server, storage and telecommunications equipment makers with a new ingredient for squeezing more performance out of space– and power–constrained environments. With total dissipated power (TDP) of 31 watts, the new low–voltage Dual–Core Intel Xeon processor is ideal for deployments requiring high compute density and power optimization, including single–height (1U) chassis and blade servers, SAN and NAS solutions, and network infrastructure equipment. The Dual–Core Intel Xeon processor LV 2.0 GHz and 1.66 GHz are available from Intel now for $ 423 and $ 209 per unit, respectively, in 1,000–unit quantities.

Intel Corporation is outfitting server, storage and telecommunications
equipment makers with a new ingredient for squeezing more performance out of
space– and power–constrained environments. It is the first low–voltage Intel®
Xeon® processor to combine dual–core technology with Intel’s innovative power
management capabilities, helping to boost energy–efficient price/performance
with up to two to four times the performance–per–watt of previous Intel Xeon
processors and platforms.**

The historical need for raw computing performance has evolved into a drive for
energy–efficient performance to meet people’s expanding demands – whether for
smaller devices, lower cooling bills or better price/performance per watt.
Energy–efficient performance enables equipment manufacturers to optimally
balance processing capabilities with power and space constraints to help meet
those demands. Intel is driving innovations in multi–core computing
architectures through a combination of silicon, architecture, platform and
software innovations to enable new levels of performance, capabilities and
energy efficiency.

With total dissipated power (TDP) of 31 watts, the new low–voltage Dual–Core
Intel Xeon processor is ideal for deployments requiring high compute density and
power optimization, including single–height (1U) chassis and blade servers, SAN
and NAS solutions, and network infrastructure equipment. The new processor
excels at handling demanding multi–threaded, multi–tasking applications such as
high–performance computing and financial services.

“The low–voltage Dual–Core Intel Xeon processor’s combined enhancements in
performance and energy efficiency, along with the efficient power and cooling
design of IBM’s industry–leading BladeCenter*, deliver a leadership integer
performance–per–watt solution,” said Doug Balog, vice president and business
line executive, IBM BladeCenter. “The new IBM BladeCenter Ultra Low Power HS20
blade* is a solid example of the innovation being brought to market through
Intel and IBM’s blade collaboration.”

To accelerate time to market for telecommunications equipment makers and
original equipment manufacturers, Intel also plans to introduce the AdvancedTCA–compliant
Intel® NetStructure® MPCBL0040 Single Board Computer (SBC). This new,
high–density–compute SBC features two of the new low–voltage Intel Xeon
processors, which equates to four high–performance cores per SBC. With the
performance boost of the new dual–core processor, the MPCBL0040 is expected to
service far more transactions and subscribers per system than previous
generation products***, which can help significantly reduce the cost per
subscriber and/or transaction and total cost of ownership. This powerful
processing capability, offered in the AdvancedTCA standard, is ideal for
applications where transaction and subscriber load can increase dramatically in
a very short time, such as IP Multimedia Services (IMS), Internet Protocol
Television (IPTV), and Wireless Control Plane applications.

“HP is helping operators and equipment providers take advantage of the trends
that are reshaping the industry, such as the evolution toward open, modular
networks; blended, content–rich services; and easy–to–use personal devices,”
said Ananda Subbiah, vice president, worldwide solutions, Network and Service
Provider Business, HP. “The performance and innovation of Intel AdvancedTCA
building blocks, combined with the comprehensive services and support of the HP
Advanced Open Telecom Platform, are enabling customers to evolve their networks
in the most strategic, cost–effective way.”

Intel is also planning to offer a blade server solution powered by up to two of
the new Dual–Core Intel Xeon processors LV for ultra–dense, low–power
environments where density is limited by power and cooling capabilities. The
Intel® Server Compute Blade SBXD62 will enable server OEMs and resellers to
offer their small– and medium–sized business customers a blade server platform
to help reduce operational costs and extend IT resources through improved
price/performance/watt, operational efficiencies, deployment flexibility and
simplified management.

The Dual–Core Intel Xeon processor LV 2.0 GHz and 1.66 GHz are available from
Intel now for $ 423 and $ 209 per unit, respectively, in 1,000–unit quantities.
The Intel NetStructure MPCBL0040 Single Board Computer is expected to be
available in the second quarter with an initial price from Intel of $ 4,495 per
unit. The Intel® Server Compute Blade SBXD62 is expected to ship in April with
an initial price from Intel of $ 945 per unit (price does not include processor,
heat sink, memory or hard drive).**** For more information about low–voltage
Dual–Core Intel Xeon processors and platforms, please visit

www.intel.com/design/intarch/xeonlv2sbc
.