Intel has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 m. The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.
Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.
Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco. Finishing the development phase for the company’s 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company’s “tick-tock” strategy.
That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months, an effort unmatched in the industry. Producing 32nm chips next year would mark the fourth consecutive year Intel has met its goal.
- 291 Mbit SRAM
- 0.171 um2 cell size
- >1.9 billion transistors
- 3.8 GHz operation
- Functional silicon demonstrated in Sept ’07
- Uses all transistor and interconnect features used on 32nm processors
Some notes from Sanjay Natarajan, Intel’s 32nm Program Manager
- Intel’s 32nm logic technology provides ~70% linear feature size scaling and ~50% area scaling compared to our very successful 45nm technology
- Transistor gate pitch is 112.5nm, the smallest of any reported 32nm technology
- The improved density of our 32nm process allows for smaller chips and more transistors per chip
- Intel continues to develop new technology generations on a 2 year cadence, realizing the benefits of Moore’s Law
- 32nm introduces Intel’s 2nd generation high-k + metal gate transistors
- 32nm transistor drive currents are ~14% higher than our 45nm process and are the highest reported in the industry
- 32nm transistor switching speed is improved >22% relative to our 45nm transistors
- We believe our 32 nm transistors are more than one generation ahead of the rest of the industry