Intel Developed Mobile WiMAX Baseband Chip

Intel today announced design completion of its first mobile WiMAX baseband chip. Combined with the company’s previously announced single-chip, multi-band WiMAX/Wi-Fi radio, the pair creates a complete chipset called the Intel® WiMAX Connection 2300. This development marks another major step in Intel’s efforts to deliver an “always best connected” mobile Internet experience for future laptops and mobile devices. The completed design of the Intel WiMAX Connection 2300 brings Intel a step closer to an integrated wireless system-on-chip that will help drive WiMAX adoption by maximizing useable space in mobile devices. As laptops become smaller, for example, they will have limited space for new technologies. With the initial Intel WiMAX Connection 2300 chipset design now complete, Intel plans to focus on validating and testing the product, with plans to sample both card and module forms beginning in late 2007.

Intel Corporation today announced design completion of its first mobile WiMAX
baseband chip. Combined with the company’s previously announced single-chip,
multi-band WiMAX/Wi-Fi radio, the pair creates a complete chipset called the
Intel® WiMAX Connection 2300. This development marks another major step in
Intel’s efforts to deliver an “always best connected” mobile Internet experience
for future laptops and mobile devices.

The Intel WiMAX Connection 2300 chipset design was demonstrated during Executive
Vice President and Chief Sales and Marketing Officer Sean Maloney’s keynote at
the 3G World Congress and Mobility Marketplace in Hong Kong.

Maloney showed an Intel® Centrino® Duo mobile technology-based laptop with
mobile WiMAX (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink
packet access (HSDPA) 3G capabilities successfully accessing the Internet at
broadband speeds over a mobile WiMAX network. The demonstration illustrates the
high-speed and quality of service capability of WiMAX for handling content-rich
applications that can be extremely responsive without interference from other
wireless technologies residing on the same system.

“Intel continues to drive innovation in mobile broadband access by eliminating
the seams that prevent ubiquitous wireless connectivity,” said Maloney. “The
Intel WiMAX Connection 2300 will help speed the deployment of mobile WiMAX, and
accelerate the availability of a new wave of “personal broadband” laptops and
mobile devices that deliver the real Internet.”

The completed design of the Intel WiMAX Connection 2300 brings Intel a step
closer to an integrated wireless system-on-chip that will help drive WiMAX
adoption by maximizing useable space in mobile devices. As laptops become
smaller, for example, they will have limited space for new technologies.
Integration also helps enable ubiquitous connectivity on ultra mobile PCs,
consumer electronics and handheld devices that have significant size constraints
for the number of cards or components.

With global frequency support for standards-based Wi-Fi and WiMAX, scalable
channel bandwidth, and high-performance multiple-antennas, the Intel WiMAX
Connection 2300 will help bring about mobile communications and rich content
across supported networks anywhere in the world. For the first time, Intel
incorporated multiple input/multiple output (MIMO) functionality into the
baseband chip to enhance the signal quality and throughput of wireless
bandwidth. The baseband chip also employs the same software for Intel’s WiMAX
and Wi-Fi solutions to help ensure unified management for connectivity.
Over-the-air provisioning supports easy configuration and enables consumer
activation of services, shifting the traditional hands on service provider
business model to a direct activation one based purely on consumer purchases of
mobile devices. The baseband chip also has low power requirements for increased
battery life and lower thermals to support smaller and thinner designs.

With the initial Intel WiMAX Connection 2300 chipset design now complete, Intel
plans to focus on validating and testing the product, with plans to sample both
card and module forms beginning in late 2007.

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