Intel Funds Cymer On EUV Lithography

Cymer and Intel have signed a development agreement for Intel to provide $ 20 million in funding over the next three years to accelerate development of production-worthy extreme ultraviolet (EUV) lithography light sources. EUV lithography is positioned for commercial deployment in 2009. Intel is aiming to reach 32-nm node chip processing by then by remaining on the Moore’s Law curve for lithography. Accelerating EUV technology development to enable its successful implementation in high-volume manufacturing for the 32-nm node in 2009 is a critical mission at Intel. This agreement will further enable Intel and Cymer to concentrate on the critical technology challenges and on delivering a cost-effective, commercial EUV source solution to produce development tools in 2006 and meet the industry’s 2009 production timeline.


Cymer and Intel have signed a development agreement for Intel
to provide $ 20 million in funding over the next three years to accelerate
development of production-worthy extreme ultraviolet (EUV) lithography light
sources. EUV lithography is positioned for commercial deployment in 2009. Intel
is aiming to reach 32-nm node chip processing by then by remaining on the
Moore’s Law curve for lithography. Accelerating EUV technology development to
enable its successful implementation in high-volume manufacturing for the 32-nm
node in 2009 is a critical mission at Intel. This agreement will further enable
Intel and Cymer to concentrate on the critical technology challenges and on
delivering a cost-effective, commercial EUV source solution to produce
development tools in 2006 and meet the industry’s 2009 production timeline.

According to a 2002 technical paper by Peter Silverman, an
Intel Fellow and director of Intel’s Lithography Capital Equipment Development,
Moore’s Law translates into three technical requirements for lithography:

  • Reduction of device pitch by 30 percent every two years,
    producing a 50-percent reduction in chip area.
  • Reduction in gate width by more 30 percent every two years,
    producing faster chips.
  • Maintaining a constant cost for lithography.
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