Intel New Nehalem & Tukwila Platforms In H2 2008

Intel is moving to IT usage based segmentation for future Nehalem and Tukwila
platforms in H2 2008. The current Itanium segment will be renamed as Mission
Critical (MC), Enterprise MP to be known as Expandable (EX), Volume DP to be
known as Efficient Performance (EP) and lastly Entry UP to be called Entry (EN).
For MC segment, Itanium 2 platform (Itanium 2 9000 series + E8870 chipset) will
be succeeded by Boxboro MC platform made up of Tukwila MC and Boxboro MC
chipset. For EX segment, Caneland Platform (Xeon 7000 series + 7300 chipset)
will be succeeded by 45nm Dunnington Nehalem based processor.

For EP 2-socket segment, Bensley platform (Xeon 5000 series + 5000P Blackford
chipset) will be succeeded by Tylersburg EP Platform made up of Nehalem EP and
Tylersburg-36D chipset and for EP single socket segment, Garlow platform (Xeon
3000 series + 3210 chipset) will be succeeded by Tylersburg EP Platform made up
of Nehalem EP and Tylersburg-36S chipset. For EN segment, Cranberry Lake
Platform (Xeon 5000 series + 5100 chipset) will be succeeded by Tylersburg-EN
Platform made up of Nehalem EP and Tylersburg-24D chipset. All the chipsets will
be featuring QuickPath technology, the next generation system interconnect used
on Nehalem and Tukwila -based platforms which is commonly known as CSI.

Intel is moving to IT usage based segmentation for future Nehalem and Tukwila
platforms in H2 2008. The current Itanium segment will be renamed as Mission
Critical (MC), Enterprise MP to be known as Expandable (EX), Volume DP to be
known as Efficient Performance (EP) and lastly Entry UP to be called Entry (EN).
For MC segment, Itanium 2 platform (Itanium 2 9000 series + E8870 chipset) will
be succeeded by Boxboro MC platform made up of Tukwila MC and Boxboro MC
chipset. For EX segment, Caneland Platform (Xeon 7000 series + 7300 chipset)
will be succeeded by 45nm Dunnington Nehalem based processor.

For EP 2-socket segment, Bensley platform (Xeon 5000 series + 5000P Blackford
chipset) will be succeeded by Tylersburg EP Platform made up of Nehalem EP and
Tylersburg-36D chipset and for EP single socket segment, Garlow platform (Xeon
3000 series + 3210 chipset) will be succeeded by Tylersburg EP Platform made up
of Nehalem EP and Tylersburg-36S chipset. For EN segment, Cranberry Lake
Platform (Xeon 5000 series + 5100 chipset) will be succeeded by Tylersburg-EN
Platform made up of Nehalem EP and Tylersburg-24D chipset. All the chipsets will
be featuring QuickPath technology, the next generation system interconnect used
on Nehalem and Tukwila -based platforms which is commonly known as CSI.

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