Intel Prepares Fab 12 For 65nm, 300mm Production

Intel has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a leading-edge 300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second volume-production fab using 65nm process technology produced on the industry’s largest wafer size (300mm), which provides the Intel fab with the potential to generate the world’s highest microprocessor output at the lowest cost. It is also the most technologically advanced, high-volume semiconductor manufacturing plant in the world building multi-core microprocessors. The Fab 12 conversion project, which began in 2004 and cost roughly $ 2 billion, was completed in approximately 18 months. Fab 12 is Intel’s fifth fab using 300mm wafers.

Intel Corporation has re-opened an advanced, high-volume semiconductor
manufacturing facility in Chandler, Ariz., converting it to a leading-edge
300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second
volume-production fab using 65nm process technology produced on the industry’s
largest wafer size (300mm), which provides the Intel fab with the potential to
generate the world’s highest microprocessor output at the lowest cost. It is
also the most technologically advanced, high-volume semiconductor manufacturing
plant in the world building multi-core microprocessors.

“The re-opening of Fab 12 marks a first for Intel and the semiconductor
industry,” said Bob Baker, senior vice president, general manger, Intel
Technology and Manufacturing Group. “The conversion of an existing factory to
leading-edge technology – both larger wafer size and most advanced semiconductor
technology – further adds to ’s manufacturing capability and improves our
ability to better serve our customers.”

The Fab 12 conversion project, which began in 2004 and cost roughly $ 2 billion,
was completed in approximately 18 months. Fab 12 is Intel’s fifth fab using
300mm wafers.

Intel has the largest network of advanced 300mm wafer fabs in the industry.
Intel’s other facilities that manufacture using 300mm wafers are Fab 11X in New
Mexico, D1D and D1C in Oregon, and Fab 24 in Ireland.

Fab 12’s re-opening is the latest in a string of six Intel announcements
regarding re-investment in its U.S. manufacturing sites. In total, the
announcements made in 2005 reflect a combination of more than $ 4 billion of new
U.S.-based manufacturing expansion announced this year and completion of this $ 2
billion investment announced in 2004. These investments will add over 2,000 jobs
(not including construction jobs).

Relocation and Retraining of the Workforce Key to New Factory’s Rapid Start

This project, which extends Intel’s presence in Arizona, capitalizes on the
area’s highly skilled workforce. As part of the conversion project, Intel sent
over 800 Fab 12 employees to other Intel fabs, including in Ireland, Oregon and
New Mexico, during the construction phase to obtain advanced training on the
newest tools and cutting edge 300mm technology.

“The logistics of relocating 800 employees and their families were extremely
complex and cost millions of dollars,” said Steve Megli, co-Plant Manager of Fab
12. “Our efforts have paid off as we have a world-class workforce and facility
poised to supply new and exciting products for Intel.”

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