Xfastest have posted high quality pictures of Intel’s Sandy Bridge bare die package, with the heatspreader removed. Pictures of the same silicon were previously published, but this time, Xfastest have revealed high quality pictures, as well as a shot of the notebook package.

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Xfastest have posted high quality pictures of Intel’s Sandy Bridge bare
die package, with the heatspreader removed. Pictures of the same silicon
were previously published, but this time, Xfastest have revealed high quality pictures, as well as a shot of the notebook package.

The above die is the quad core version, and is rumoured to have a die size of approximately 225 mm2. It continues Intel’s recent tradition of rectangular dies, though Sandy Bridge is further elongated by the addition of an on-die IGP.

The above shot is the die package of the notebook Sandy Bridge. Do note that the die is identical to the desktop version, and the apparent size seems different due to the much more compact notebook package.

Reference: Xfastest