Intel’s next-generation notebook will have an integrated 3G chip from Nokia and improved graphics support for Microsoft’s Windows Vista. Nokia’s HSDPA (High-Speed Downlink Packet Access) technology will appear on motherboards bearing Intel’s Santa Rosa package. Notebook makers have been experimenting with integrated chips that can connect to cellular data networks, and with these plans, Intel will make Nokia’s technology part of its Centrino package of chips. Santa Rosa is scheduled to arrive in the first half of 2007.

Intel’s next-generation notebook will have an integrated 3G chip from Nokia and improved graphics support for Microsoft’s Windows Vista. Nokia’s HSDPA (High-Speed Downlink Packet Access) technology will appear on motherboards bearing Intel’s Santa Rosa package. Notebook makers have been experimenting with integrated chips that can connect to cellular data networks, and with these plans, Intel will make Nokia’s technology part of its Centrino package of chips. Santa Rosa is scheduled to arrive in the first half of 2007.