DDR2 667SO DIMM s Kingmax DDRII 667 SO DIMM Available

Kingmax announced its latest Venus series DDRII 667 SO-DIMM modules at the 2005 Computex Taipei exhibition. Since then, Kingmax has completed all the
preparations for mass production and the Kingmax DDRII 667 SO-DIMM modules are
now available on the market.
Kingmax DDRII 667 SO-DIMM Notebook Memory Features :

* 200-pin 667MHz DDRII
* CAS Latency: 5
* Voltage: 1.8V, reduces power consumption by approximately 50%; outstanding
heat dispersion features
* Capacity: 256MB/512MB/1GB
* High degree of compatibility and stability
* Global lifetime warranty

DDR2 667SO DIMM Kingmax DDRII 667 SO DIMM Available

Intel’s recent announcement of its new mobile platform – Napa – has propelled
the already rapidly developing mobile technology industry into the third
generation. The announcement also implies that dual-core systems will soon be
available for notebooks. In only one short year, Intel has exceeded Moore’s Law
in the evolution from Sonoma to Napa, and once again proven its undisputed
superiority in the CPU industry.

The Napa architecture consists of three components, the CPU, chipset and
wireless module, all of which have been updated with the new generation— the
Intel 945 series chipset, Intel Core processor and Intel 3945ABG wireless
module. The biggest differences between Napa and the second-generation Sonoma
platform are the upgrade of the front-side bus to 667MHz, support for PCI
Express x16 and DDRII 667 memory. The Intel Core will be available in single and
dual-core configurations built on a 65 nm process. The Intel Pro/Wireless
3945ABG wireless module is compatible with 802.11a/b/g wireless protocols. Most
importantly, the Napa platform modules are extremely small, providing more
flexibility for a wider variety of notebook designs, and the new platform
provides a reduction in power consumption of 1.2W, leading to longer battery
life and improved performance.

If the Sonoma platform brought notebooks into the DDRII age, Napa presents
another leap forward in notebook memory specifications, as DDRII 667 will follow
the growth of the Napa platform to become the mainstream memory of choice for
notebooks. The advantage of DDRII memory in mobile platforms is its low-power
advantages. However, mass production of notebook DDRII memory is no simple feat.
Currently only a handful of memory manufacturers have the capacity to
mass-produce DDRII 667 SO-DIMM modules.

Packaging and testing requirements for notebook DDRII 667 memory pose
considerable challenges for memory makers. It is well known by now that BGA is
the default packaging format for DDRII memory. What this means is that, in the
DDRII era, only companies who possess substantial BGA packaging technology
capabilities will be able to achieve broad market acceptance. Only those
companies who have accumulated years of technology experience and possess the
core BGA packaging technologies will be able to compete.

Kingmax is one of the few companies who possess these advantages. As the only
memory module maker in the world with its own advanced packaging and testing
facilities, Kingmax has a complete, vertically integrated supply chain. Kingmax
operates its own packaging facilities and handles the entire manufacturing
process from purchasing and dicing of wafers, testing and packaging to finished
product testing. Kingmax developed BGA packaging technology eight years ago and
has successfully utilized it in the mass production of its SDRAM and DDR
products. This proprietary patented technology – TinyBGA – is highly praised
throughout the industry. Kingmax is fully equipped to handle the exacting
challenges of BGA packaging, including technical expertise, equipment upgrades
and personnel training.

Kingmax also has considerable expertise in the IC testing field. In 2005,
Kingmax invested US$ 10 million to bring in the latest T5593 testing equipment.
Because of its high cost, only a small number of memory manufacturers possess
this advanced testing instrument, and even dedicated IC packaging and testing
fabs can provide only limited capacity. With the T5593, Kingmax can filter out
the highest frequency chips and use those for mass production. For Kingmax, this
means the ability to lead the market using its own technology to solidify its
position at the forefront of the industry.

At the same time, Kingmax also possesses significant advantages in notebook
memory compatibility issues. Kingmax has strategic partnerships with nearly all
of the world’s major notebook manufacturers, and conducts cooperative
development during the design stage to test memory for compatibility with a wide
variety of notebook specifications. For the major notebook brands, Kingmax has
already completed initial compatibility testing. Additionally, each Kingmax
memory module undergoes strict testing for stability and compatibility prior to
shipment to ensure optimum performance on a wide variety of notebook platforms.

Kingmax announced its latest Venus series DDRII 667 SO-DIMM modules at the 2005
Computex Taipei exhibition. Since then, Kingmax has completed all the
preparations for mass production and the Kingmax DDRII 667 SO-DIMM modules are
now available on the market. This memory series provides all of the functions
for the latest memory trends in terms of data transfer frequencies, application
performance and compatibility.

Additionally, as industries around the globe seek to make production less
harmful to the environment, KINGMAX has adopted a lead-free process for the
manufacturing of its DDR2 SO-DIMM memory, using lead-free IC dies, PCB, and
soldering material, thus fully meeting the environmental protection standards of
North America, Europe, Japan, and China.

Kingmax’s next generation DDRII memory architecture technology complies with
JEDEC standards for DDRII 667 SO-DIMM high-specification memory, and supports
lower working voltage design (1.8V), which can reduce power consumption by
approximately 50%. With a working frequency of 333MHz, the SO-DIMM memory can
take advantage of up to 5.3GB of memory bandwidth with its 200pin configuration.
Additionally, integrated ODT (on-die-termination) technology maintains memory
signal waves at high speeds, minimizing noise interference. All of these
advantages combine to provide outstanding performance for the entire system for
consumers.

Kingmax DDRII 667 SO-DIMM Notebook Memory Features
l 200-pin 667MHz DDRII
l CAS Latency: 5
l Voltage: 1.8V, reduces power consumption by approximately 50%; outstanding
heat dispersion features
l Capacity: 256MB/512MB/1GB
l High degree of compatibility and stability
l Global lifetime warranty