Kingmax recently launched the Mars DDRII 667 memory, which is embedded with a
red ASIC decoder chip and the company’s proprietary TinyBGA color packaging
technology. With a low 1.8
volts of working voltage that cuts power consumption by 50%, the Mars DDRII 667
can run at JEDEC standard 4-4-4-12 latency timings, making it the perfect
support for all new-generation DDRII high-speed computers. As part of its move to embrace the new DDRII era, Kingmax has
recently spent nearly US$ 10 million to purchase T5593 testing equipment. This
high-tech equipment enables the testing of higher clock rate DDRII memory and
ensures the highest quality for Mars DDRII 667.

Kingmax recently launched the Mars DDRII 667 memory, which is embedded with a
red ASIC decoder chip and the company’s proprietary TinyBGA color packaging
technology. This new Kingmax memory product is 100% counterfeit-proof, and
symbolizes the fiery, strong heart of Mars, the god of war.

In terms of technical specifications, Mars DDRII 667 is equipped with up to
8.6GB/s memory bandwidth and fully supports Prescott/Tejas 1067MHz FSB and
direct integration of ODT technology increases system stability. With a low 1.8
volts of working voltage that cuts power consumption by 50%, the Mars DDRII 667
can run at JEDEC standard 4-4-4-12 latency timings, making it the perfect
support for all new-generation DDRII high-speed computers. Just as DDR has
replaced SDRAM, DDRII — with its new specifications and powerful functions —
will soon replace current DDR specifications as the market mainstream.

New-generation DDRII memory requires high technical expertise on the part of
memory module manufacturers. At Kingmax, a memory chip is considered to be up to
standard only after it has passed the pre-processing, post-processing,
inspection, packaging and testing stages. During the pre-processing stage, the
silicon wafer is cut into small chips and simple EDS testing is carried out,
completing testing on most chip functions. The post-processing stage involves
I/O (input/output) configuration and protection, while the inspection stage
covers full testing of the entire chip. During the final stage, chips that have
passed inspection are packaged and tested again, and only fully compliant chips
are used in the making of memory modules. Only DDRII memory produced under such
a strict process can offer guaranteed performance, stability and compatibility.

Packaging technology, in particular, determines a memory modules working
stability. Currently, most DDRs and SDRAMs use the TSOP packaging method, but
BGA packaging is mandatory for DDRII according to JEDEC standards. With BGA
packaging, there is a wider space at the bottom of the chip, which allows for a
higher pin count while guaranteeing larger spacing between pins and meets the
higher density signal input/output requirements essential for DDRII.
Furthermore, BGA packaging offers other advantages, such as easy chip
installation, better electrical performance, less delay in signal transmission,
which allow for high-frequency operation and excellent heat dispersion.

Kingmax developed BGA packaging technology eight years ago and has successfully
utilized it in the mass production of its SDRAM and DDR products. This
proprietary patented technology V TinyBGA– is highly recognized in the
industry. Kingmax has used this cutting-edge technology since the SDRAM PC66/100
era, when it was used only with high-end semiconductor products (e.g. CPU). With
over eight years of experience, Kingmax is extensively equipped to handle the
exacting challenges faced in BGA packaging, including technical expertise,
equipment upgrades and personnel training.

Kingmax is the worlds only memory module maker to possess its own packaging and
testing equipment. As part of its move to embrace the new DDRII era, Kingmax has
recently spent nearly US$ 10 million to purchase T5593 testing equipment. This
high-tech equipment enables the testing of higher clock rate DDRII memory and
ensures the highest quality for Mars DDRII 667. Furthermore, as the worlds top
memory module maker, Kingmax maintains a close partnership with major
motherboard makers. All Kingmax memory products are 100% tested on actual
equipment and verified by major motherboard makers for stability and
compatibility before shipment. This allows Kingmax to offer a lifetime original
manufacturers warranty for all of its memory products.

Kingmaxs strong technical background evokes the power of Mars. When facing
market challenges, Kingmax will display extraordinary perseverance and
determination in the spirit of Mars to win the best opportunities.