The Kingmax DDRII
800 will soon make its debut after the DDRII 533/667 completes mass production
and once again prove its capabilties as a top memory manufacturer. In the
earlier part of the year at Cebit Hannover and Computex Taipei, Kingmax first
unveiled the new DDRII 800 memory, which consumers will be seeing on the market
very soon. With T5593
equipment, Kingmax is able to perform strict tests to ensure speeds over 800MHz
on our memory chips, and mass produce the highest-quality DDRII-800 memory
module available.
Kingmax Mars DDRII-800 Long-DIMM:

· 240-pin DDRII 800MHz
· CAS LatencyG5-5-5-15
· Memory Bandwidth: 6.4GB/s
· Voltage: 1.8V, Lowering energy consumption by 50%; the best thermal dispersion
functions
· Capacity: 512MB/1GB


Intel’s recent release of the 955X/945 chipset quickly captured the attention
of many major motherboard manufacturers. The new 955/945 chipset supports 1066
MHz FSB and DDRII memory, with increased capacity for the latter. Intel’s latest
chipset roadmaps indicate that the Broadwater chipset, which is set for launch
in Q2 2006, will also support dual channel DDRII800 memory.

In addition, according to recent news, AMD will soon be releasing an upgraded
memory controller for its Athlon 64 and Opteron platforms, with full support for
DDRII. Suffice to say, the age of DDRII has arrived.

Most memory manufacturers hold large ambitions for the DDRII market today.
Indeed, the arrival of the DDRII age is an once-in-a-lifetime opportunity that
will test the true technical strength of memory manufacturers. The Kingmax DDRII
800 will soon make its debut after the DDRII 533/667 completes mass production
and once again prove its capabilties as a top memory manufacturer. In the
earlier part of the year at Cebit Hannover and Computex Taipei, Kingmax first
unveiled the new DDRII 800 memory, which consumers will be seeing on the market
very soon.

Kingmax is the world’s number number one manufacturer with its own packaging and
testing advanced equipment for memory modules. With a complete, vertically
integrated supply chain, Kingmax operates its own packaging facilities and
handles the entire manfacturing process from purchasing and dicing of wafers,
testing and packaging, to testing of the finished product.

For the past seven years, Kingmax has been developing its Ball Grid Array (BGA)
packaging and has successfully applied the process to mass production of its
SDRAM and DDR products. This proprietary patented memory technology — TinyBGA
packaging technology — is widely lauded in industry circles. With our technical
discipline, state-of-the-art equipment, and personnel training, Kingmax has
proven its capabilities in performing the strict tests required for BGA
packaging.

In Q2 of this year, Kingmax started to use T5593 testing equipment in its
operations – an investment worth nearly USD 10 million. Because of the high
cost, very few factories use such high-tech equipment; as a result, testing
output from even the most advanced IC packaging testing manufacturers is
limited. As a leading manufacturer of memory modules, Kingmax has also made
large investments in R&D and testing and production facilities. With T5593
equipment, Kingmax is able to perform strict tests to ensure speeds over 800MHz
on our memory chips, and mass produce the highest-quality DDRII-800 memory
module available.

Kingmax has devoted its efforts to researching lead-free production process
technologies, and gives equal consideration to the environment and product
efficiency. Our high-quality DDRII memory chips are lead-free – we produce all
chips under environmentally-friendly conditions, use lead-free IC chips, and
employ environmentally-suitable soldering materials and temperatures in PCB and
SMT production. Kingmax chips have also passed high-temperature tests, and fully
conform to the European Union’s RoHS directive as well as the environmental
requirements of the US, Japan, and China. With our lead-free manufacturing
process and mass production capabilities, Kingmax continues to hold the upper
hand with its future competitiveness.

Kingmax Mars DDRII-800 Long-DIMM:
240-pin DDRII 800MHz
CAS LatencyG5-5-5-15
Memory Bandwidth: 6.4GB/s
Voltage: 1.8V, Lowering energy consumption by 50%; the best thermal dispersion
functions
Capacity: 512MB/1GB