Some time ago, we did an article previewing the next generation Highend Desktop (HEDT) platform from Intel. We admit, we’ve been neglecting what would first appear before Waimea Bay, and that is the mainstream processors based on Intel’s next generation Sandy Bridge microprocesor architecture.
Intel’s next generation microprocessor architecture – Sandy Bridge, will first see the light in the Mainstream segment. Sandy Bridge-MS, as it is called, will find itself on FCLGA1155 sockets.
Join us in staring hard at the differences between these sockets.
Called the Sandy Bridge-MS, these processors will appear in a 1155 land package, going into mainboards that use 6 series chipsets.
We had gotten news from industry insiders that the heatsink mounting holes for LGA1155 and LGA1156 will remain the same. What is of interest is of course, whether LGA1155 processors will be backward compatible with LGA1156 mainboards that are flooding the market right now.
Given the different architecture, we are anticipating vastly different pinouts (or landouts) on the new Sandy Bridge-MS CPUs. It is hence of no surprise that our comparison image shows that the two orientation notches have shifted. Don’t expect the new LGA1155 mainboards to befriend LGA1156 CPUs.
You can see the one pin lost on the socket in the top left corner of the image. Physical construction of the socket is principally the same, and LGA1155 processors will come with a similarly sized heatspreader. Because a large number of the pins are dedicated to the memory controller I/O, and Sandy Bridge-MS retains a Dual Channel Integrated Memory Controller (IMC), the pin count stays pretty much the same.