Micron is introducing today a 1 gigabit (Gb) double data rate (DDR)3 device that provides these key applications with faster speed, lower power and increased memory density. Evaluation samples of Micron’s leading-edge 1Gb DDR3 components are available to select customers with production expected to begin early next year. Micron’s 1Gb DDR3 components will be available in various output configurations (x4, x8 and x16), and will be fully compliant to the most recent JEDEC DDR3 specifications (JEDEC is the leading developer of standards for the semiconductor industry). These components will support module densities from 512 megabytes (MB) through 4 gigabytes (GB) and a variety of module types including FBDIMMs, UDIMMs, SODIMMs, and RDIMMs. A 2Gb DDR3 device is also expected to be available from Micron early next year, helping to enable even higher density applications.

Memory performance is becoming increasingly critical for a wide range of
applications including PC gaming, servers, super computing and high-definition
television (HDTV). All of these applications process a large amount of data that
needs to be accessed quickly and efficiently. To enable the next level of memory
performance for these applications, Micron Technology, Inc., is introducing
today a 1 gigabit (Gb) double data rate (DDR)3 device that provides these key
applications with faster speed, lower power and increased memory density.

"We are excited to introduce the world’s first 1Gb DDR3 components," said Brian
Shirley, vice president of Micron’s memory group. "Micron’s strength in advanced
DRAM technology has given us the industry leading position in high density
memory solutions."

Micron’s DDR3 products will support data rates of 800 megatransfers per second
(MT/s) to 1,600 MT/s with clock frequencies of 400 megahertz (MHz) to 800 MHz
respectively, doubling the speed from DDR2. At DDR3’s top speed, a 100,000-page
document can be transferred in approximately one second. The DDR3 supply voltage
has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30
percent; the device is manufactured on Micron’s 78nm process technology. These
DDR3 benefits will help enable the next level of performance in a wide array of
computing devices.

"Early 2007 should bring memory thirsty computing and consumer applications,
such as Microsoft’s anticipated Vista operating system. DDR3 will initially
benefit the server, notebook, and desktop markets and will then reach consumer
applications such as graphics and HDTVs," said Shane Rau, senior analyst of IDC,
a market intelligence firm.

Evaluation samples of Micron’s leading-edge 1Gb DDR3 components are available to
select customers with production expected to begin early next year. Micron’s 1Gb
DDR3 components will be available in various output configurations (x4, x8 and
x16), and will be fully compliant to the most recent JEDEC DDR3 specifications (JEDEC
is the leading developer of standards for the semiconductor industry). These
components will support module densities from 512 megabytes (MB) through 4
gigabytes (GB) and a variety of module types including FBDIMMs, UDIMMs, SODIMMs,
and RDIMMs.

A 2Gb DDR3 device is also expected to be available from Micron early next year,
helping to enable even higher density applications.