Micron 4 GB DDR2 RDIMMs Validated

Micron is the first supplier to validate 4GB DDR2 registered DIMMs and the first to validate a high-density DDR2 module solution employing stacked component technology, with Intel. The industry-standard, 240-pin PC2-3200 DDR2 RDIMM, is populated with thirty-six 1Gb DDR2 components using Staktek’s high-performance Stakpak® technology. Micron’s 4GB RDIMM, MT36HTJ51272Y-40E, is in production and currently available to customers.

Micron Technology, Inc. today announced it is the first supplier to validate
4 gigabyte (GB) DDR2 registered dual inline modules (DIMMs), and the first to
validate a high-density DDR2 module solution employing stacked component
technology, with Intel. The industry-standard, 240-pin PC2-3200 DDR2 RDIMM, is
populated with thirty-six 1Gb DDR2 components using Staktek’s high-performance
Stakpak® technology. Micron’s 4GB RDIMM, MT36HTJ51272Y-40E, is in production and
currently available to customers.

"Micron’s latest 4GB DDR2 RDIMM and the underlying stacked 1Gb DDR2
technology is the first to pass Intel’s module validation," said Tom Macdonald,
vice president and general manager of Intel’s Advanced Chipset Division. "DDR2
validation and production availability from key memory suppliers such as Micron
is important in enabling Intel® architecture-based server platform customers
with the latest high-density solutions."

"Intel platform validation of 4GB DDR2 RDIMMs solidifies our leadership position
in both server memory technology and DDR2 products," said Terry Lee, Executive
Director of Advanced Technology and Strategic Marketing for Micron’s Systems
Memory Group. "These devices are the highest-density modules available today,
enabling server and workstation customers to ship systems containing 16GB of
DDR2 memory while only populating four module slots. Micron offers the broadest
DDR2 product solutions available today for meeting the memory requirements of
notebook, desktop, and server computing products."

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