Micron delivered the industry’s first four gigabyte (4GB) DDR2
registered dual in-line memory module (RDIMM) to Intel Corporation. The
industry-standard, 240-pin PC2-4300 DDR2 RDIMM is populated with thirty-six one
gigabit (1Gb) DDR2 components using a stacked FBGA technology.

“Micron’s demonstration of a 4GB RDIMM and the underlying 1Gb
DDR2 technology is another important step in enabling Intel® server platform
customers with the latest high-density solutions,” said Pete MacWilliams, Intel
Senior Fellow, Intel Corporation.

“We are leveraging Micron’s leading position with 1Gb DDR2 to
become the first supplier to demonstrate these high-density DDR2 RDIMMs,” said
Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for
Micron’s Computing and Consumer Group. “4GB DDR2 RDIMMs are the highest-density
modules available today, enabling server and workstation customers to ship
systems containing 16GB of DDR2 memory while only populating four module slots.”

Micron delivered the industry’s first four gigabyte (4GB) DDR2
registered dual in-line memory module (RDIMM) to Intel Corporation. The
industry-standard, 240-pin PC2-4300 DDR2 RDIMM is populated with thirty-six one
gigabit (1Gb) DDR2 components using a stacked FBGA technology.

“Micron’s demonstration of a 4GB RDIMM and the underlying 1Gb
DDR2 technology is another important step in enabling Intel® server platform
customers with the latest high-density solutions,” said Pete MacWilliams, Intel
Senior Fellow, Intel Corporation.

“We are leveraging Micron’s leading position with 1Gb DDR2 to
become the first supplier to demonstrate these high-density DDR2 RDIMMs,” said
Terry Lee, Executive Director of Advanced Technology and Strategic Marketing for
Micron’s Computing and Consumer Group. “4GB DDR2 RDIMMs are the highest-density
modules available today, enabling server and workstation customers to ship
systems containing 16GB of DDR2 memory while only populating four module slots.”