Boy Genius Report posted a series of images that tell us more about the (exposed) internals of Apple's next iPhone 5S smartphone.

Despite what many think, the 2013 iPhone (infamously dubbed the iPhone 5S by the media and just about everyone else) will be a big upgrade to last year's iPhone 5. While the iPhone 5 brought a new design, change in display aspect ratio as well as screen resolution, the iPhone 5S will be more about changes on the inside rather than superficial ones.

Apple is planning a major overhaul to the internals of the iPhone 5S and by this we aren't referring to the processor, or RAM, or GPU. We are talking about changes such as a new vibrating motor assembly, or a new loud-speaker bracket and ear speaker bracket as well as a tweaked SIM card tray, all inside the (next) 7th generation Apple iPhone.

Vibrating motor assembly

BGR reports that although news about the new vibrating motor assembly was leaked earlier, this is the first time that the web has actually seen a high resolution image of the same.

Ear Speaker and Loud Speaker Brackets

The next iPhone will also pack redesigned ear speaker and loud speaker brackets.

Wi-Fi Flex cable ribbon

SIM Card trays

Also included is a newer, thinner SIM card tray for the iPhone 5S. Notice the two different colors which nicely lines up with previous reports suggesting that Apple's next iPhone will be offered in various flavors (colors) apart from the usual internal storage differences.

Apple is expected to unveil the next iPhone in next month's WWDC conference alongside the reveal and launch of a completely revamped iOS 7 operating system. Seems Apple is making some big changes to its mobile platform (both hardware and software). We say it's well about time!

Source: BGR

 

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