Earlier this week Apple finally unveiled the new MacBook Pro 2013 lineup which comes with Haswell processors. A new teardown of the new laptops reveals that they have slimmer cooling systems than before.
A laptop’s size and weight, or that of any other device for that matter, obviously depends upon its internal hardware. If a manufacturer can figure out how to save weight and space inside a device, it can create an iteration that’s thinner and lighter than its predecessors. That’s exactly what Apple did with the new MacBook Pro 2013 models. By shifting to the much more power efficient Intel Haswell architecture, Apple was able to create lighter and thinner laptops without having to compromise on performance or build quality.
The folks at iFixit recently did a teardown of both the new 13 inch and 15 inch MacBook Pro with Haswell. It found that there are no longer two fans in the 13 inch model’s clamshell, just one. This might possibly be one of the reasons why Apple was able to reduce the cross section of the 13 inch MacBook Pro. Apart from that, both 13 and 15 inch models have new streamlined heatsinks that join the CPU and GPU thermal pads together, thus freeing up considerable space inside the shell.
One thing that’s likely to irk users is the fact that the headset jack is now soldered onto the logic board directly, it is no longer connected through a wire or ribbon. While this does make a repair job much more complicated, it also leads to more free space inside, which Apple can then use to make its products even better than before.