• 0.13 micron at TSMC or IBM
  • 205-210 million of transistors
  • High Speed Interconnect (HSI) – AGP8x Protocol w/ PCI
    Express Bridge
  • 500-600MHz Core Clock
  • GDDR1/2/3 Memory controller
  • 600-800Mhz Memory Clock
  • 16 full rendering pipelines
  • Pixel and Vertex Shaders 3.0
  • DirectX 9.0 and OpenGL support
  • Launch delayed to April






 
Q1 200
4

Q2 200
4
High EndNV40 (HSI)
NV41
(PCI Express x16)
NV45
(PCI Express x16)
MainstreamNV39
(HSI)

NV43 (PCI Express x16)
Low CostNV37
(HSI)

NV42 (PCI Express x16)
OEMNV19
(HSI)
 
DirectX ClassDX
9.0c (Shader 3.0)
  • 0.13 micron at TSMC or IBM
  • 205-210 million of transistors
  • High Speed Interconnect (HSI) – AGP8x Protocol w/ PCI
    Express Bridge
  • 500-600MHz Core Clock
  • GDDR1/2/3 Memory controller
  • 600-800Mhz Memory Clock
  • 16 full rendering pipelines
  • Pixel and Vertex Shaders 3.0
  • DirectX 9.0 and OpenGL support
  • Launch delayed to April