OCZ today unveiled a blazing fast DDR3 addition to the new Flex II memory series. These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.

Flex2 back logo OCZ Unveiled PC3 1600 CL8 8 8 Flex II Series

Sunnyvale, CA—April 17, 2008—OCZ Technology Group, a worldwide leader in
innovative, ultra-high performance and high reliability memory, today unveiled a
blazing fast DDR3 addition to the new Flex II memory series. These premium
modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added
performance to high-end systems with integrated water-cooling. Designed to the
very core to offer enthusiasts the thermal management innovation of hybrid water
and passive cooling, the new PC3-16000 Flex II Series offers rock-solid
stability and performance for your high-end gaming or overclocking system.

The OCZ Flex II heat management solution enables high-frequency memory to
operate within an optimal balance of extreme speeds and low latencies without
the high temperatures that inhibit or damage the module. Each PC3-16000 Flex II
memory module features this breakthrough thermal management technology from OCZ
that combines an effective new heatspreader design with integrated liquid
injection system and dedicated channels directly over the module’s ICs to
effectively dissipate heat produced by high-speed memory. This sophisticated
series was engineered with a unique “flexible” design to give enthusiasts the
option to run the modules passively or water cooled via the thick array of
aluminum fins, and the concurrent use of both options promotes maximum heat
dissipation.

“A data rate of 2GHz was unthinkable only a year ago,” commented Dr. Michael
Schuette, VP of Technology Development at OCZ Technology. “Power consumption and
heat generation directly follow the operating frequency; therefore, the thermal
dissipation of these modules exceeds any specifications of the original design
and requires the most advanced thermal solution that will reliably work under
any conditions. Whether in a water-cooling environment or else under air-cooling
conditions, the legacy of the Flex series continues with the Flex II design as
the most advanced memory cooling solution for the fastest modules out there.”

The PC3-16000 Flex II modules are optimized for the latest cutting edge DDR3
platforms featuring the new NVIDIA ® 790i chipset and will be available in 2GB
(2x1024MB) dual channel kits. In its continued effort to make overclocking a
user-friendly pastime, OCZ includes all the necessary accessories right in the
box to setup your unique water-cooling system immediately after purchase,
without the inconvenience of searching for additional hardware. As part of OCZ’s
line-up of premium memory, the Flex II series is backed by a Lifetime Warranty
and industry-leading technical support.

Harnessing the elite performance of incredible DDR3 speeds, tight timings, and
leading-edge heat dissipation, the unparalleled design of the new Flex II is a
complete, all-encompassing solution certain to set a new standard for
water-cooling enthusiasts making the leap into the next generation of platforms.