Amidst rumours of a low-yielding 40nm process and both ATI and nVidia moving fabrication from TSMC to Globalfoundries, TSMC have announced their 28nm high-K metal gate Low Power process.

The new process is expected to start risk production by the end of Q1 2010, sooner than expected, for low-power chips, with high performance chips starting in Q2 2010. Production is expected to start by Q3 2010.

Amidst rumours of a low-yielding 40nm process and both ATI and nVidia moving fabrication from TSMC to Globalfoundries, TSMC have announced their 28nm high-K metal gate Low Power process.

The new process is expected to start risk production by the end of Q1 2010, sooner than expected, for low-power chips, with high performance chips starting in Q2 2010. Production is expected to start by Q3 2010. 

Full press release:

http://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&language=E&newsid=4041