Rambus announced that Qimonda AG, a leading global producer of DRAM memory products, recently signed a technology license agreement for the Rambus XDR™ memory interface solution. The Rambus XDR solution will be implemented in Qimonda’s 75nm process technology for integration into high-volume applications, including game consoles, digital televisions, set-top boxes and PC graphics. Rambus XDR DRAM, as part of the XDR memory architecture, achieves an order of magnitude higher performance than today’s standard memories. Perfect for graphics processing, consumer electronics, network, and server applications, a single, 2-byte wide, 3.2 GHz XDR DRAM component provides 6.4 GB/sec of peak bandwidth, and enables PCB savings and cost savings by utilizing the fewest number of ICs.

Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing
companies specializing in high-speed chip interfaces, today announced that
Qimonda AG, a leading global producer of DRAM memory products, recently signed a
technology license agreement for the Rambus XDR™ memory interface solution. The
Rambus XDR solution will be implemented in Qimonda’s 75nm process technology for
integration into high-volume applications, including game consoles, digital
televisions, set-top boxes and PC graphics.

“Since signing a patent license agreement with Qimonda, we have worked towards a
relationship where our engineering teams could collaborate on leadership memory
solutions to serve the global market,” said Sharon Holt, senior vice president
of Worldwide Sales, Licensing and Marketing at Rambus. “We are very proud to be
working with Qimonda to deliver this advanced memory product for a growing
number of applications in computing and digital entertainment.”

“The XDR memory solution completes our broad graphics RAM portfolio to better
serve high-performance and high-bandwidth applications for the fast growing
global computing and consumer electronics markets,” said Robert Feurle, vice
president and general manager of Graphics DRAM at Qimonda.

Rambus XDR DRAM, as part of the XDR memory architecture, achieves an order of
magnitude higher performance than today’s standard memories. Perfect for
graphics processing, consumer electronics, network, and server applications, a
single, 2-byte wide, 3.2 GHz XDR DRAM component provides 6.4 GB/sec of peak
bandwidth, and enables PCB savings and cost savings by utilizing the fewest
number of ICs.

The advanced XDR memory architecture features key enabling technologies built on
patented Rambus innovations, including:

Differential Rambus Signaling Level (DRSL), a low-voltage, low-power,
differential signaling standard that enables scalable multi-GHz, bi-directional,
and point-to-point data busses that connect an XDR memory controller (XIO) to
XDR DRAM devices;
Octal Data Rate (ODR), a technology that transfers eight bits of data on each
clock cycle, four times as many as today’s state-of-the-art memory technologies
that use DDR (Double Data Rate) clocking;

FlexPhase™, a circuit technology that enables flexible phase relationships
between signals, allowing precise on-chip alignment of data with clock; and
Dynamic-Point-to-Point (DPP), an innovation that maintains the signal integrity
benefits of point-to-point signaling on the data bus, while providing the
flexibility of capacity expansions with module upgrades. DPP was recognized with
a “2005 Innovation of the Year” award by industry publication EDN Magazine.
For more information about the Rambus XDR memory architecture consisting of the
XDR DRAM device, the XCG (XDR Clock Generator), the XIO controller interface
cell, and the XDR memory controller (XMC), as well as the next generation of XDR
DRAM (XDR2), starting at 8GHz with micro-threading, please visit
www.rambus.com/xdr