Hardspell is
reporting that R600 GDDR3 card uses 12 layers PCB while the R600 GDDR4 card uses
12-16 layers PCB. The silicon for R600 only reaches A13 revision and there are
no A14, 15 or 17 revisions. According to them, currently all the ATi R600
benchmarks out there aren’t real and R600 core clock is not lower than 800MHz.
VR-Zone has learned about some updates on R600 availability. Apparently R600
GDDR3 will be available in early May while R600 GDDR4 will be available in mid
May but in limited quantities. We will see some R600 demos at CeBIT but behind
doors.

Hardspell is
reporting that R600 GDDR3 card uses 12 layers PCB while the R600 GDDR4 card uses
12-16 layers PCB. The silicon for R600 only reaches A13 revision and there are
no A14, 15 or 17 revisions. According to them, currently all the ATi R600
benchmarks out there aren’t real and R600 core clock is not lower than 800MHz.
VR-Zone has learned about some updates on R600 availability. Apparently R600
GDDR3 will be available in early May while R600 GDDR4 will be available in mid
May but in limited quantities. We will see some R600 demos at CeBIT but behind
doors.