VR-Zone

 

The embedded multi-chip package (eMCP) memory will come in a variety of densities and will employ LPDDR2 DRAM using 30nm process technology and NAND flash memory using 20nm process technology.

 

Each package will feature a 4GB embedded MultiMediaCard (eMMC) using an NAND chip for data storage, and a choice of 256MB, 512MB or 768MB DRAM chip for delivering higher performance on mobile devices.

 

 

“As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density,” said Myungho Kim, VP of memory marketing at Samsung's Device Solutions division. “Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012.”

 

The 30nm LPDDR2 DRAM will give data transmission speeds of 1,066 Mb/s, double that of previous mobile DRAM. It also performs 30 percent better and uses 25 percent less power than 40nm LPDDR2 DRAM. Chip manufacturing productivity also increases 60 percent as a result.

 

Samsung also offers a high-end eMCP product that combines 1GB of 30nm LPDDR2 DRAM and 32GB of eMMC memory using a 20nm NAND flash chip.