Samsung has developed the industry’s first process to enable innovative production of a 16-chip multi-chip package (MCP) of memory. The new MCP technology supports the industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications. Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated-wafer to reduce the overall thickness to only 30-micrometers (§­).

061101 Samsung Developed 16 chip Multi chip Package For Memory

Samsung Electronics Co., Ltd., the world leader in advanced memory
technology, announced today that it has developed the industry’s first process
to enable innovative production of a 16-chip multi-chip package (MCP) of memory.
The new MCP technology supports the industry-wide demand for small form factors
and high-densities that will accommodate multimedia-intensive user applications.
Samsung’s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can
enable up to a 16 gigabyte (GB) MCP solution.

Advanced multi-chip package technology requires a combination of key processes
such as wafer thinning technology, redistribution layer technology, chip sawing
technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer
thinning was a critical design obstacle. For the new 16-chip process, Samsung
introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the
thickness of each fabricated-wafer to reduce the overall thickness to only
30-micrometers (㎛). This is just 65 percent the thickness of the 10-chip MCP
wafer (45㎛) Samsung developed in 2005 and similar to the size a human cell,
which measures 20 to 30㎛.

As part of its MCP breakthrough, Samsung also developed a new laser-cutting
technology to cut the wafer into individual chips. This new cutting process
prevents the memory chips from breaking into pieces when they are cut using
conventional blade sawing technology, which was originally designed only for
sawing wafers up to 80㎛-thick.

To vertically stack identically-sized dies (chips), a redistribution layer
technology also is applied in Samsung’s new multi-stack MCP process, to enable
wafer fabricators to adhere the wire contacts from just one side, unlike the
conventional method of extending wire connection from both sides of each chip.
Along with a single wire contact per die, the dies are placed in a zig-zag stack
to minimize the use of space and the length of the wire connectors. Moreover,
the thickness of the adhesive has been reduced to 20㎛bringing the height of
a16-die stacked height to 1.4mm. ( A 10-chip MCP uses 60㎛adhesive layer and has
a total height of 1.6mm.)

Samsung’s new 16-chip MCP was developed just one year after the development of
the first 10-chip MCP, widening the company’s lead in MCP advancements over
other memory makers to two years. The new 16-chip MCP package technology
provides the highest density solution yet developed for the creation of slimmer
consumer electronics, in response to the increasing demand for more multimedia
features in mobile devices.