Samsung is gearing up to start mass production of a new mobile application processor (AP) with increased performance and lower power consumption compared to previous models.
According to related sources, Samsung Electronics’ System LSI operation division produced a test model of an original 28nm High-K Metal Gate (HKMG) process based mobile AP named “Exynos 5400” (codename: Adonis).
The Exynos 5400 utilizes ARM’s latest Cortex A15 architecture, and packs 4 CPU cores with a low power-consuming GPU as a bonus.
Thanks to process miniaturization and an upgraded GPU, the Adonis gets not only a boost in power but also burns through a battery a lot slower than the existing 32nm HKMG based Exynos 5250 (Cortex A15).
Should Samsung keep on schedule with mass production, this chip is set to be the first mobile AP on the market which utilizes a 28nm HKMG process. TSMC are collaborating with Samsung Electronics to provide a foundry to fabricate Qualcomm’s latest Snapdragon iteration; however this product will not be HKMG based. Instead it will utilize a traditional SiON silicon based process.
HKMG enables the manufacturing of low power-consuming chips as ultra-miniaturization of the fabrication process can take place without the side effect of current leakage associated with shrinking processes based on the regular SiON approach.
According to market analyzers Strategy Analytics, Samsung Electronics took 2nd place with 25.9% market share of the mobile AP market in the Q2 of this year, compared to market leader Qualcomm who possessed 38.8%.
The product is expected to reach market in the first half of next year, and analysts predict it will be used in the next iteration of Samsung’s flagship Galaxy smartphone (Galaxy S4) for some localities. Mass production is slated to commence at the end of this year.