A team of international scientists has made a gigantic stride forward to develop next-generation memory chips, which are more progressed compared to the current best 60-nanometer products. The conventional fashion of making top-end chips, called photolithography, cannot progress beyond the current level. The legacy method is based on a top-down process just like decomposing huge rocks (silicon wafers) into a wall. But the new self-assembly nanotechnology is like building blocks into a wall. Theoretically, they can make a 10-nanometer semiconductor with our new technology. The world’s leading companies like IBM are racing to embrace it. Kim has applied local and international patents for the breakthrough. The findings will be printed in the next edition of the U.S.-based journal Science.

A team of international scientists has made a gigantic stride forward to develop next-generation memory chips, which are more progressed compared to the current best 60-nanometer products. The conventional fashion of making top-end chips, called photolithography, cannot progress beyond the current level. The legacy method is based on a top-down process just like decomposing huge rocks (silicon wafers) into a wall. But the new self-assembly nanotechnology is like building blocks into a wall. Theoretically, they can make a 10-nanometer semiconductor with our new technology. The world’s leading companies like IBM are racing to embrace it. Kim has applied local and international patents for the breakthrough. The findings will be printed in the next edition of the U.S.-based journal Science.